B
Binbin Guan
Researcher at University of California, Davis
Publications - 68
Citations - 2018
Binbin Guan is an academic researcher from University of California, Davis. The author has contributed to research in topics: Photonic integrated circuit & Silicon photonics. The author has an hindex of 24, co-authored 68 publications receiving 1757 citations. Previous affiliations of Binbin Guan include Bell Labs.
Papers
More filters
Proceedings ArticleDOI
30×30 MIMO transmission over 15 spatial modes
Nicolas K. Fontaine,Roland Ryf,Haoshuo Chen,Amado Velazquez Benitez,J. E. Antonio Lopez,R. Amezcua Correa,Binbin Guan,Burcu Ercan,Ryan P. Scott,S. J. Ben Yoo,Lars Gruner-Nielsen,Yi Sun,Robert J. Lingle +12 more
TL;DR: 15-mode photonic lanterns enabled low-loss coupling into and out of the fiber and a time-multiplexed coherent receiver facilitates measurement of all 30 signals.
Journal ArticleDOI
All-fiber mode-group-selective photonic lantern using graded-index multimode fibers.
Bin Huang,Nicolas K. Fontaine,Roland Ryf,Binbin Guan,Sergio G. Leon-Saval,Roman Shubochkin,Yi Sun,Robert Lingle,Guifang Li +8 more
TL;DR: The use of the multimode graded-index fibers in the taper can significantly relax the adiabaticity requirement in comparison with using single-mode fibers.
Journal ArticleDOI
Free-space coherent optical communication with orbital angular, momentum multiplexing/demultiplexing using a hybrid 3D photonic integrated circuit
Binbin Guan,Ryan P. Scott,Chuan Qin,Nicolas K. Fontaine,Tiehui Su,Carlo Ferrari,Mark Cappuzzo,F.P. Klemens,Bob Keller,Mark Earnshaw,S. J. B. Yoo +10 more
TL;DR: Free-space space-division-multiplexing (SDM) with 15 orbital angular momentum (OAM) states using a three-dimensional (3D) photonic integrated circuit (PIC) using a low excess loss hybrid device.
Journal ArticleDOI
CMOS-compatible, athermal silicon ring modulators clad with titanium dioxide.
Stevan S. Djordjevic,Kuanping Shang,Binbin Guan,Stanley T. S. Cheung,Ling Liao,Juthika Basak,Hai-Feng Liu,S. J. B. Yoo +7 more
TL;DR: A new CMOS-compatible fabrication process involving low temperature RF magnetron sputtering of high-density and low-loss a-TiO(2) that can withstand subsequent elevated-temperature CMOS processes is developed.
Journal ArticleDOI
Low-loss compact multilayer silicon nitride platform for 3D photonic integrated circuits.
TL;DR: The designed platform, with 200 nm thick waveguide core and 700 nm interlayer gap, is compatible for active thermal tuning and applicable to realizing compact photonic devices such as arrayed waveguide gratings (AWGs).