Binyu Wang

TL;DR: In this article, the authors proposed a double-sided cooling based on planar packaging method, which can get rid of the thermal and electrical challenges in multichip SiC power modules.

TL;DR: The results show that when the power factor is greater than 0.4, using RC-IGBT can significantly improve the thermal performance of MMC submodules (SMs) and extend their lifetime.

TL;DR: In this paper, an optimized and low-cost air-cooling system dedicated to the application of MMCs is proposed, where O-shaped heat pipes are embedded on the heatsink to add another thermal path without extra fans and fins.

TL;DR: In this article, a transient 3D thermal modeling method for insulated gate bipolar transistor (IGBT) modules is proposed to obtain accurate temperature distribution considering uneven power losses and cooling conditions.

TL;DR: This paper studies the fundamental-frequency thermal cycles and proposes a lifetime estimation method of MMC SMs based on the combination of finite element analysis (FEA) and the physical lifetime model which provides a deeper physical description of the failure mechanism and considers the thermal coupling among the chips, which make the lifetime calculation more accurate.