C. Ding

TL;DR: In this article, the authors proposed a 3.5 mm-thick Ti-based flat heat pipe for thermal ground plane (TGP) applications, which is constructed by laser welding two microfabricated titanium substrates to form a hermetically sealed vapor chamber.

TL;DR: Titanium-based thermal ground planes are described in this article, where a titanium substrate comprising a plurality of pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, can be used to transport thermal energy from one region of the thermal ground plane to another region.

TL;DR: This technique to produce aligned neurofilament networks for direct imaging and diffraction studies using in situ dialysis in a microfluidic device can be expanded to facilitate structural studies of a wide range of filamentous proteins and their hierarchical assemblies under varying assembly conditions.

TL;DR: In this paper, the feasibility of the fabrication of titanium-based MEMS RF switches for harsh environment applications was investigated and two design generations of electrostatically-actuated Bulk-Titanium MEMS (BTMEMS) switches were fabricated and tested.

TL;DR: Static contact angle and dynamic spreading studies clearly demonstrate enhanced hydrophilicity of microstructured Ti surfaces with a superficial porous TiO2 layer, which promises interesting applications in the microfluidics and microsystems fields.