C
Chin-Hsiang Cheng
Researcher at National Cheng Kung University
Publications - 150
Citations - 3850
Chin-Hsiang Cheng is an academic researcher from National Cheng Kung University. The author has contributed to research in topics: Heat transfer & Stirling engine. The author has an hindex of 33, co-authored 144 publications receiving 3416 citations. Previous affiliations of Chin-Hsiang Cheng include Tatung University.
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A three-dimensional numerical modeling of thermoelectric device with consideration of coupling of temperature field and electric potential field
TL;DR: In this article, a general, three-dimensional numerical model of thermoelectric devices with consideration of coupling of temperature field and electric potential field was developed to figure out the performance of TECs with the temperature dependent thermal conductivity, electric conductivity and Seebeck coefficient of semiconductor materials.
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Development of an energy-saving module via combination of solar cells and thermoelectric coolers for green building applications
TL;DR: In this article, a solar-driven thermoelectric cooling module with a waste heat regeneration unit designed for green building applications is investigated in a model house, where experiments are conducted to investigate the cooling efficiency of the module.
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Flow reversal and heat transfer of fully developed mixed convection in vertical channels
TL;DR: In this paper, three fundamental combinations of thermal boundary conditions on the respective wall surface (i.e., isoflux-isoflux, isoftluxisothermal, and isothermal-isothermal) are considered separately so as to investigate extensively their distinct influence on the flow pattern.
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Numerical model for predicting thermodynamic cycle and thermal efficiency of a beta-type Stirling engine with rhombic-drive mechanism
Chin-Hsiang Cheng,Ying-Ju Yu +1 more
TL;DR: In this article, a numerical model for a beta-type Stirling engine with rhombic-drive mechanism is presented, which takes into account the non-isothermal effects, the effectiveness of the regenerative channel, and the thermal resistance of the heating head.
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A three-dimensional theoretical model for predicting transient thermal behavior of thermoelectric coolers
TL;DR: In this paper, a simulation model is developed and used to predict transient thermal behavior of the thermoelectric coolers, where the P-N pair is treated as a single bulk material and the temperature difference between the semiconductor elements was not evaluated.