The invention relates to a device for preparing a high-quality high-depth-diameter-ratio micro hole by using a light ray obtained through femtosecond laser time domain/space shaping, and belongs to the field of transparent material micro-machining. According to the technical scheme, pulse time domain shaping equipment is used for generating a femtosecond laser pulse sequence; the position of a to-be-machined sample is adjusted to enable the light rays to generate micro holes with the maximum depths in the sample; the neutron pulse time delay of the pulse sequence is optimized so as to improvethe micro hole quality; a half-wave plate and a polarizing plate are combined for use to adjust the energy of lasers focused by two lenses correspondingly so as to enable the diameters of the micro holes formed by the lasers after being focused by the two lenses in the to-be-machined sample to be equal; the two focusing lenses are adjusted to enable the two independent light rays to be collinear in space and to be overlapped in an end-to-end mode to form an extended uniform light ray; and the position of the sample is moved to enable the light ray which is overlapped in the end-to-end mode togenerate a micro hole with the maximum depth-diameter ratio on the sample. According to the device, the quality and the depth-diameter ratio of the machined micro hole can be remarkably improved, themicro hole diameter adjusting range is wide, the machining environment is free of special requirements, the machining efficiency is high, and the machining cost is low.

Device for preparing high-quality high-depth-diameter-ratio micro hole by using light ray obtained through femtosecond laser time domain/space shaping

The invention belongs to the technical field of laser machining and specifically relates to a machining method and system of a micropore with the high coaxiality and the large depth-diameter ratio The defects that an existing micropore is limited in depth-diameter ratio machining, poor in coaxiality, high in machining cost and the like are overcome Through the method and system, switching of Bethel beam parameters required for counter bores and through holes is realized through a spatial light modulator by switching different Bethel beam holograms online, and finally, machining on the coaxial through hole and counter bores is realized online As there is no need to repeatedly clamp a workpiece or replace a machining head through the method, the positions of the workpiece and the machining head are kept unchanged all the time Machining of the workpiece is completed at a time The coaxiality of the through hole and the counter bore is ensured, and manufacturing of the micropore with the large depth-diameter ratio is facilitated

Machining method and system of micropore with high coaxiality and large depth-diameter ratio

The present invention aims to provide a Bessel beam laser machining apparatus for a high aspect ratio hole, which allows a micro-shape having a high aspect ratio to be processed with high degree of accuracy by performing laser machining using a Bessel beam. The other aim of the present invention is to provide the Bessel beam laser machining apparatus for processing a high aspect ratio hole, which is economical and excellently compatible with an existing apparatus by allowing only a simple optical system to be the necessary composition to perform high aspect ratio machining.

Choi Ji Yeon

Papers

Bessel beam laser machining apparatus for high aspect rate hole