There are many, many inventions described herein. In one aspect, what is disclosed is a digital camera including a plurality of arrays of photo detectors, including a first array of photo detectors to sample an intensity of light of a first wavelength and a second array of photo detectors to sample an intensity of light of a second wavelength. The digital camera further may also include a first lens disposed in an optical path of the first array of photo detectors, wherein the first lens includes a predetermined optical response to the light of the first wavelength, and a second lens disposed in with an optical path of the second array of photo detectors wherein the second lens includes a predetermined optical response to the light of the second wavelength. In addition, the digital camera may include signal processing circuitry, coupled to the first and second arrays of photo detectors, to generate a composite image using (i) data which is representative of the intensity of light sampled by the first array of photo detectors, and (ii) data which is representative of the intensity of light sampled by the second array of photo detectors; wherein the first array of photo detectors, the second array of photo detectors, and the signal processing circuitry are integrated on or in the same semiconductor substrate.

Apparatus for multiple camera devices and method of operating same

Despite the fact that we live in a 3D world and macroscale engineering is 3D, conventional submillimeter-scale engineering is inherently 2D. New fabrication and patterning strategies are needed to enable truly 3D-engineered structures at small size scales. Here, strategies that have been developed over the past two decades that seek to enable such millimeter to nanoscale 3D fabrication and patterning are reviewed. A focus is the strategy of self-assembly, specifically in a biologically inspired, more deterministic form, known as self-folding. Self-folding methods can leverage the strengths of lithography to enable the construction of precisely patterned 3D structures and “smart” components. This self-assembly approach is compared with other 3D fabrication paradigms, and its advantages and disadvantages are discussed.

Frontispiece images reprinted with permission from References25,55,138,80, copyrights 2009, Nature Publishing Group, 2006 and 2007, IOP Publishing, 2001, Conference of Photopolymer Science and Technology, and with permission from Adam Cohen, Microfabrica Inc.

/pdf/three-dimensional-fabrication-at-small-size-scales-3qmffdp3pi.pdf

Three‐Dimensional Fabrication at Small Size Scales

A digital camera includes a plurality of channels and a processing component operatively coupled to the plurality of channels. Each channel of the plurality of channels includes an optics component and a sensor that includes an array of photo-detectors. The processing component is configured to separately control an integration time of each channel, where a first integration time of a first channel is less than a second integration time of a second channel. The processing component is also configured to combine data from the plurality of channels to generate an image.

Large dynamic range cameras

The confluence of market demand for greatly improved compact power sources for portable electronics with the rapidly expanding capability of micromachining technology has made feasible the development of gas turbines in the millimeter-size range. With airfoil spans measured in 100’s of microns rather than meters, these “microengines” have about 1 millionth the air flow of large gas turbines and thus should produce about 1 millionth the power, 10-100 W. Based on semiconductor industry-derived processing of materials such as silicon and silicon carbide to submicron accuracy, such devices are known as micro-electro-mechanical systems (MEMS). Current millimeter-scale designs use centrifugal turbomachinery with pressure ratios in the range of 2:1 to 4:1 and turbine inlet temperatures of 1200-1600 K. The projected performance of these engines are on a par with gas turbines of the 1940’s. The thermodynamics of MEMS gas turbines are the same as those for large engines but the mechanics differ due to scaling considerations and manufacturing constraints. The principal challenge is to arrive at a design which meets the thermodynamic and component functional requirements while staying within the realm of realizable micromachining technology. This paper reviews the state-of-the-art of millimeter-size gas turbine engines, including system design and integration, manufacturing, materials, component design, accessories, applications, and economics. It discusses the underlying technical issues, reviews current design approaches, and discusses future development and applications.

http://users.ntua.gr/rogdemma/MILLIMETER-SCALE,%20MEMS%20GAS%20TURBINE%20ENGINES.pdf

Millimeter-Scale, MEMS Gas Turbine Engines

Digital camera systems and methods are described that provide a color digital camera with direct luminance detection. The luminance signals are obtained directly from a broadband image sensor channel without interpolation of RGB data. The chrominance signals are obtained from one or more additional image sensor channels comprising red and/or blue color band detection capability. The red and blue signals are directly combined with the luminance image sensor channel signals. The digital camera generates and outputs an image in YCrCb color space by directly combining outputs of the broadband, red and blue sensors.

Digital cameras with direct luminance and chrominance detection

Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.

Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing

Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional microstructures, such as for power MEMS devices. However, there are several bonding issues that MEMS technologists have to face and overcome to successfully build multilayered structures. Among these are: (1) Chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding, (2) Increased stiffness due to multiple bonded wafers and/or thick wafers, (3) Bonding tool effects, and (4) Defect propagation to other wafer levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any MEMS project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.

D. Ward

Papers

Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing

Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing

A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing