D
Dibyajat Mishra
Researcher at Texas Instruments
Publications - 21
Citations - 113
Dibyajat Mishra is an academic researcher from Texas Instruments. The author has contributed to research in topics: Electromigration & Inductor. The author has an hindex of 6, co-authored 21 publications receiving 91 citations. Previous affiliations of Dibyajat Mishra include Indian Institute of Technology Kharagpur & Georgia Institute of Technology.
Papers
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Journal ArticleDOI
System Scaling With Nanostructured Power and RF Components
TL;DR: The impact of nanostructured materials toward enhancing the performance and miniaturization of power and radio-frequency (RF) passive components in emerging smart systems is shown.
Journal ArticleDOI
Magnetic losses in metal nanoparticle-insulator nanocomposites
TL;DR: In this paper, metal nanoparticle-insulator nanocomposites were synthesized and characterized for their magnetic loss and frequency-stability to understand the role of metal particle size and oxide passivation.
Book ChapterDOI
Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components
P. Markondeya Raj,Parthasarathi Chakraborti,Dibyajat Mishra,Himani Sharma,Saumya Gandhi,Srikrishna Sitaraman,Rao Tummala +6 more
TL;DR: In this article, the role of nanostructured materials for high-density capacitors and inductors in power modules is discussed, and application of nanoscale materials as nanocomposite dielectrics and magneto-dielectrics with stable and high permeability and permittivity for miniaturized RF modules.
Journal ArticleDOI
Structure-magnetic property correlations in nickel-polymer nanocomposites
K. P. Murali,Himani Sharma,P. Markondeya Raj,Dibyajat Mishra,Manik Goyal,Kathleen Silver,Erik Shipton,Rao Tummala +7 more
TL;DR: In this paper, an epoxy matrix nanocomposites with nickel nanoparticles of two different sizes were processed and characterized to investigate their structure-magnetic prop- erty correlations.
Journal ArticleDOI
Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer
TL;DR: In this paper, the extreme sensitivity of the microstructure evolution in Sn-Ag-Cu (SAC) micro-solder joint, consisting of 15-20µm thick solder alloy and electrolytic Ni plated Cu electrodes, to electromigration (EM) conditions resulting from a kinetic competition between the growth of Ni3Sn4 intermetallic compound (IMC) and EM of Sn in solder matrix is reported.