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Dibyajat Mishra

Researcher at Texas Instruments

Publications -  21
Citations -  113

Dibyajat Mishra is an academic researcher from Texas Instruments. The author has contributed to research in topics: Electromigration & Inductor. The author has an hindex of 6, co-authored 21 publications receiving 91 citations. Previous affiliations of Dibyajat Mishra include Indian Institute of Technology Kharagpur & Georgia Institute of Technology.

Papers
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Journal ArticleDOI

System Scaling With Nanostructured Power and RF Components

TL;DR: The impact of nanostructured materials toward enhancing the performance and miniaturization of power and radio-frequency (RF) passive components in emerging smart systems is shown.
Journal ArticleDOI

Magnetic losses in metal nanoparticle-insulator nanocomposites

TL;DR: In this paper, metal nanoparticle-insulator nanocomposites were synthesized and characterized for their magnetic loss and frequency-stability to understand the role of metal particle size and oxide passivation.
Book ChapterDOI

Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components

TL;DR: In this article, the role of nanostructured materials for high-density capacitors and inductors in power modules is discussed, and application of nanoscale materials as nanocomposite dielectrics and magneto-dielectrics with stable and high permeability and permittivity for miniaturized RF modules.
Journal ArticleDOI

Structure-magnetic property correlations in nickel-polymer nanocomposites

TL;DR: In this paper, an epoxy matrix nanocomposites with nickel nanoparticles of two different sizes were processed and characterized to investigate their structure-magnetic prop- erty correlations.
Journal ArticleDOI

Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

TL;DR: In this paper, the extreme sensitivity of the microstructure evolution in Sn-Ag-Cu (SAC) micro-solder joint, consisting of 15-20µm thick solder alloy and electrolytic Ni plated Cu electrodes, to electromigration (EM) conditions resulting from a kinetic competition between the growth of Ni3Sn4 intermetallic compound (IMC) and EM of Sn in solder matrix is reported.