Srikrishna Sitaraman

TL;DR: In this article, the authors demonstrate ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept.

TL;DR: In this paper, an innovative and miniaturized thin-film bandpass filter with coupled spiral structures in ultrathin glass substrates was proposed for two applications: 3D integrated passive devices and embedded thinfilm filters in RF modules.

TL;DR: The impact of nanostructured materials toward enhancing the performance and miniaturization of power and radio-frequency (RF) passive components in emerging smart systems is shown.

TL;DR: In this paper, the authors proposed and evaluated three important resonance suppression techniques based on the 3-D interposer die configuration, the selection and placement of decoupling capacitors, and the 3D interposition package power and ground stack-up.

Abstract: du Abstract- Nanocomposite and nanolayered dielectrics provide new avenues to enhance the performance of RF and power components. They enable engineering of properties such as permeability, permittivity, frequency­ and temperature-stab ility, and tunability, along with low loss, to miniaturize next-generation multiband RF modules that require higher functional density and improved performance. This paper demonstrates two such advances in nanodielectrics: l.)Magnetic nanocomposites for miniaturization of antennas, meta materials and other RF components, 2.)Nanolayered stack dielectrics for tunable RF components with temperature- and frequency-stabilit y and low loss. The materials design, synthesis, processing and characterization to demonstrate the superior properties are presented.