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F. Gattiker

Researcher at Swiss Federal Laboratories for Materials Science and Technology

Publications -  17
Citations -  222

F. Gattiker is an academic researcher from Swiss Federal Laboratories for Materials Science and Technology. The author has contributed to research in topics: Microchannel & Bond strength. The author has an hindex of 7, co-authored 17 publications receiving 209 citations. Previous affiliations of F. Gattiker include ETH Zurich.

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Novel ultrasound read-out for a wireless implantable passive strain sensor (WIPSS)

TL;DR: In this paper, a load-monitoring concept consisting of a passive load sensor and its associated external ultrasound-based read-out unit is proposed to monitor the deformation of orthopedic implants during rehabilitation.
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Solvent assisted bonding of polymethylmethacrylate: characterization using the response surface methodology

TL;DR: In this paper, a solvent assisted bonding process was developed for the fabrication of closed microchannels made from polymethylmethacrylate (PMMA), and the effects of four process parameters on the deformation and the bond strength of the microchannel have been investigated using the response surface methodology (RSM).

Solvent Assisted Bonding of Polymethylmethacrylate: Characterization Using the Response Surface Methodology; Eurosensors XXII; ; Proceedings of the EUROSENSORS XXII Conference

TL;DR: In this article, a solvent assisted bonding process was developed for the fabrication of closed micro channels made from polymethylmethacrylate (PMMA), and the effects of four processing parameters on the deformation and the bond strength of the micro channel were investigated using the response surface methodology (RSM).
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Transesophageal Real-Time Three-Dimensional Echocardiography: Methods and Initial In Vitro and Human In Vivo Studies

TL;DR: In vitro and in vivo studies show particularly the potential for navigation in the heart and large vessels on the basis of stereoscopic images, and transesophageal real-time 3D echocardiography can be technically realized with the system presented here.
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Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method

TL;DR: In this article, a new variant of the anodic bonding technique called Activated Liquid Tin Solder Anodic Bonding (ALTSAB) is described, which offers a number of advantages for direct glass to metal sealing over conventional methods.