Deposits of clastic carbonate-dominated (calciclastic) sedimentary slope systems in the rock record have been identified mostly as linearly-consistent carbonate apron deposits, even though most ancient clastic carbonate slope deposits fit the submarine fan systems better. Calciclastic submarine fans are consequently rarely described and are poorly understood. Subsequently, very little is known especially in mud-dominated calciclastic submarine fan systems. Presented in this study are a sedimentological core and petrographic characterisation of samples from eleven boreholes from the Lower Carboniferous of Bowland Basin (Northwest England) that reveals a >250 m thick calciturbidite complex deposited in a calciclastic submarine fan setting. Seven facies are recognised from core and thin section characterisation and are grouped into three carbonate turbidite sequences. They include: 1) Calciturbidites, comprising mostly of highto low-density, wavy-laminated bioclast-rich facies; 2) low-density densite mudstones which are characterised by planar laminated and unlaminated muddominated facies; and 3) Calcidebrites which are muddy or hyper-concentrated debrisflow deposits occurring as poorly-sorted, chaotic, mud-supported floatstones. These

Phd by thesis

Lithography is a field in which advances proceed at a swift pace. This book was written to address several needs, and the revisions for the second edition were made with those original objectives in mind. Many new topics have been included in this text commensurate with the progress that has taken place during the past few years, and several subjects are discussed in more detail. This book is intended to serve as an introduction to the science of microlithography for people who are unfamiliar with the subject. Topics directly related to the tools used to manufacture integrated circuits are addressed in depth, including such topics as overlay, the stages of exposure, tools, and light sources. This text also contains numerous references for students who want to investigate particular topics in more detail, and they provide the experienced lithographer with lists of references by topic as well. It is expected that the reader of this book will have a foundation in basic physics and chemistry. No topics will require knowledge of mathematics beyond elementary calculus.

Principles of Lithography

Extreme ultraviolet lithography (EUVL) was thoroughly reviewed over a broad range of topics, including history, tools, source, metrology, condenser and projection optics, resists, and masks. Since 1988, many studies on EUVL have been conducted in North America, Europe, and Japan, through state sponsored programs and industrial consortiums. To date, no “show stopper” has been identified, but challenges are present in almost all aspects of EUVL technology. Commercial alpha lithography step-and-scan tools are installed with full-field capability; however, EUVL power at intermediate focus (IF) has not yet met volume manufacturing requirements. Compared with the target of 180W IF power, current tools can supply only approximately 55–62W. EUV IF power has been improved gradually from xenon- to tin-discharge-produced plasma or laser-produced plasma. EUVL resist has improved significantly in the last few years, with 25nm 1:1 line/space resolution being produced with approximately 2.7nm (3σ) line edge roughness. A...

Extreme ultraviolet lithography: A review

Silicon photonics has experienced phenomenal transformations over the last decade. In this paper, we present some of the notable advances in silicon-based passive and active optical interconnect components, and highlight some of our key contributions. Light is also cast on few other parallel technologies that are working in tandem with silicon-based structures, and providing unique functions not achievable with any single system acting alone. With an increasing utilization of CMOS foundries for silicon photonics fabrication, a viable path for realizing extremely low-cost integrated optoelectronics has been paved. These advances are expected to benefit several application domains in the years to come, including communication networks, sensing, and nonlinear systems.

Recent advances in silicon-based passive and active optical interconnects

PECVD silicon nitride photonic wire waveguides have been fabricated in a CMOS pilot line. Both clad and unclad single mode wire waveguides were measured at λ = 532, 780, and 900 nm, respectively. The dependence of loss on wire width, wavelength, and cladding is discussed in detail. Cladded multimode and singlemode waveguides show a loss well below 1 dB/cm in the 532-900 nm wavelength range. For singlemode unclad waveguides, losses 1 dB/cm were achieved at λ = 900 nm, whereas losses were measured in the range of 1-3 dB/cm for λ = 780 and 532 nm, respectively.

http://photonics.intec.ugent.be/download/pub_3280.pdf

Low-Loss Singlemode PECVD Silicon Nitride Photonic Wire Waveguides for 532–900 nm Wavelength Window Fabricated Within a CMOS Pilot Line

A highly efficient grating structure for the coupling between standard optical fibers and single-mode waveguides in the silicon-on-insulator platform realized in a CMOS fabrication process is presented. The cost-effective method introduces a backside metal mirror to the grating coupler without need of an extensive wafer-to-wafer bonding. A coupling efficiency of −1.6 dB (around 69%) near the telecommunication wavelength 1550 nm and a large 1dB-bandwidth of 48 nm are achieved.

Cost-effective CMOS-compatible grating couplers with backside metal mirror and 69% coupling efficiency.

In order to increase the rigidity of a membrane mask that can be used for ion projection lithography, a second wafer made of the material of the membrane layer is provided in addition to a first wafer. The second wafer is patterned in the same way as the first wafer to form a second carrying ring and is fitted on the membrane layer in a mirror-inverted manner with respect to the first wafer so that the membrane area is arranged between the first and second carrying rings in a centered manner in the direction perpendicular to the membrane plane.

Large-area membrane mask and method for fabricating the mask

For extreme ultraviolet lithography (EUVL) the absorber binary mask is until now the most promising mask type. Since at EUV only reflective masks are possible, EUVL will introduce new materials for mask manufacturing. In addition it is likely that the pattern of an EUV mask will consist of a structured double layer system. Therefore, mask CD-SEM metrology for EUVL has to deal with the contrast of rather new materials and has to face a more complex mask pattern topography situation. Using a Monte Carlo model, we simulate the SEM-signals emerging from a given EUV mask pattern topography while scanned by the electron beam of a SEM. The simulation is tuned to closely match the experimental situation of a commercial CD-SEM. Generated SEM images are analyzed by means of a commercial CD-algorithm and a peak detection CD-algorithm. Knowing the exact pattern shape that are fed into the simulation, we determine the effect of specific pattern profile changes on SEM-signal and algorithm specific CD.

Impact of EUV mask pattern profile shape on CD measured by CD-SEM

A detailed evaluation study has been performed with respect to the suitability of projection electron and ion multi-beam
lithography for the fabrication of leading-edge complex masks. The study includes recent results as obtained with
electron and ion multi-beam proof-of-concept systems with 200x reduction projection optics where patterns are
generated on substrates using a programmable aperture plate system (APS) with integrated CMOS electronics,
generating several thousands of well defined beams in parallel. A comparison of electron and ion projection multi-beam
writing is provided, in particular with respect to the suitability to expose non-chemically amplified resist (non-CAR)
materials. The extendibility of projection multi-beam technologies for 16nm hp, 11nm hp and 8nm hp mask nodes is
discussed as well as for wafer direct write for 22nm hp and below.

Charged particle multi-beam lithography evaluations for sub-16nm hp mask node fabrication and wafer direct write

Positive tone chemically amplified resists CAP209, EP012M (TOK), KRS-XE (JSR) and FEP171 (Fuji) were evaluated for mask making. The investigations were performed on an advanced tool set comprising of a Steag coater ASR5000, Steag developer ASP5000, 50kV e-beam writer Leica SB350, UNAXIS MASK ETCHER III , STS ICP silicon etcher and a CD-SEM KLA8100. We investigated and compared resolution, sensitivity, resist slope, dark field loss, CD-uniformity, line edge roughness, and etch resistance of the evaluated resists. Furthermore, the influence of post coating delay, post exposure delay and other process parameters on the resist performance was determined.

Florian Letzkus

Papers

Cost-effective CMOS-compatible grating couplers with backside metal mirror and 69% coupling efficiency.

Large-area membrane mask and method for fabricating the mask

Impact of EUV mask pattern profile shape on CD measured by CD-SEM

Charged particle multi-beam lithography evaluations for sub-16nm hp mask node fabrication and wafer direct write

Comparative evaluation of e-beam sensitive chemically amplified resists for mask making