Thermal Conductivity of Polymer-Based Composites: Fundamentals and Applications

The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.

Novel nanostructured thermal interface materials: a review

Thermal interface materials (TIMs) are crucial components of high density electronics and the high thermal conductivity of graphite makes this material an attractive candidate for such applications. We report an investigation of the in-plane and through-plane electrical and thermal conductivities of thin thermal interface layers of graphite nanoplatelet (GNP) based composites. The in-plane electrical conductivity exceeds its through-plane counterpart by three orders of magnitude, whereas the ratio of the thermal conductivities is about 5. Scanning electron microscopy reveals that the anisotropy in the transport properties is due to the in-plane alignment of the GNPs which occurs during the formation of the thermal interface layer. Because the alignment in the thermal interface layer suppresses the through-plane component of the thermal conductivity, the anisotropy strongly degrades the performance of GNP-based composites in the geometry required for typical thermal management applications and must be taken into account in the development of GNP-based TIMs.

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Anisotropic Thermal and Electrical Properties of Thin Thermal Interface Layers of Graphite Nanoplatelet-Based Composites

Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

Recent trends including rapid increases in the power ratings and continued miniaturization of semiconductor devices have pushed the heat dissipation of power electronics well beyond the range of conventional thermal management solutions, making control of device temperature a critical issue in the thermal packaging of power electronics. Although evaporative cooling is capable of removing very high heat fluxes, two-phase cold plates have received little attention for cooling power electronics modules. In this work, device-level analytical modeling and system-level thermal simulation are used to examine and compare single-phase and two-phase cold plates for a specified inverter module, consisting of 12 pairs of silicon insulated gate bipolar transistor (IGBT) devices and diodes. For the conditions studied, an R134a-cooled, two-phase cold plate is found to substantially reduce the maximum IGBT temperature and spatial temperature variation, as well as reduce the pumping power and flow rate, in comparison to a conventional single-phase water-cooled cold plate. These results suggest that two-phase cold plates can be used to substantially improve the performance, reliability, and conversion efficiency of power electronics systems.

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package. Reducing the thermal resistance of this thermal interface material (TIM) can help achieve the FreedomCAR program goals of using a glycol water mixture at 105degC or even air cooling. It is desirable to keep the maximum temperature of the conventional silicon die below 125degC, trench insulated gate bipolar transistors (IGBTs) below 150degC, and silicon carbide-based devices below 200degC. Using improved thermal interface materials enables the realization of these goals and the dissipation of high heat fluxes. The ability to dissipate high heat fluxes in turn enables a reduction in die size, cost, weight, and volume. This paper describes our progress in characterizing the thermal performance of some conventional and novel thermal interface materials. We acquired, modified, and improved an apparatus based on the ASTM D5470 test method and measured the thermal resistance of various conventional greases. We also measured the performance of select phase-change materials and thermoplastics through the ASTM steady-state and the transient laser flash approaches, and compared the two methodologies. These experimental results for thermal resistance are cast in the context of automotive power electronics cooling. Results from numerical finite element modeling indicate that the thermal resistance of the TIM layer has a dramatic effect on the maximum temperature in the IGBT package.

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G. Eesley

Papers

Thermal interface materials for power electronics applications