There is provided controlled fabrication of a solid state structural feature on a solid state structure by exposing the structure to a fabrication process environment the conditions of which are selected to produce a prespecified feature in the structure. A physical detection species is directed toward a designated structure location during process environment exposure of the structure, and the detection species is detected in a trajectory from traversal of the designated structure location, to indicate changing physical dimensions of the prespecified feature. The fabrication process environment is then controlled in response to the physical species detection to fabricate the structural feature. Also provided is a method for controlling a physical dimension of a structural feature or to form a feature by exposing the structure to a flux of ions at a selected structure temperature, the exposure conditions being controlled to cause formation of the feature or to cause at least one physical dimension of the feature to be changed, substantially by transport of material of the structure to the structural feature in response to the ion flux exposure.

Control of solid state dimensional features

For controlling a physical dimension of a solid state structural feature, a solid state structure is provided, having a surface and having a structural feature. The structure is exposed to a first periodic flux of ions having a first exposure duty cycle characterized by a first ion exposure duration and a first nonexposure duration for the first duty cycle, and then at a second periodic flux of ions having a second exposure duty cycle characterized by a second ion exposure duration and a second nonexposure duration that is greater than the first nonexposure duration, for the second duty cycle, to cause transport, within the structure including the structure surface, of material of the structure to the structural feature in response to the ion flux exposure to change at least one physical dimension of the feature substantially by locally adding material of the structure to the feature.

Pulsed ion beam control of solid state features

A method for controlling a gap in an electrically conducting solid state structure provided with a gap. The structure is exposed to a fabrication process environment conditions of which are selected to alter an extent of the gap. During exposure of the structure to the process environment, a voltage bias is applied across the gap. Electron tunneling current across the gap is measured during the process environment exposure and the process environment is controlled during process environment exposure based on tunneling current measurement. A method for controlling the gap between electrically conducting electrodes provided on a support structure. Each electrode has an electrode tip separated from other electrode tips by a gap. The electrodes are exposed to a flux of ions causing transport of material of the electrodes to corresponding electrode tips, locally adding material of the electrodes to electrode tips in the gap.

Controlled fabrication of gaps in electrically conducting structures

A solid state nanopore device including two or more materials and a method for fabricating the same. The device includes a solid state insulating membrane having an exposed surface, a conductive material disposed on at least a portion of the exposed surface of the solid state membrane, and a nanopore penetrating an area of the conductive material and at least a portion of the solid state membrane. During fabrication a conductive material is applied on a portion of a solid state membrane surface, and a nanopore of a first diameter is formed. When the surface is exposed to an ion beam, material from the membrane and conductive material flows to reduce the diameter of the nanopore. A method for evaluating a polymer molecule using the solid state nanopore device is also described. The device is contacted with the polymer molecule and the molecule is passed through the nanopore, allowing each monomer of the polymer molecule to be monitored.

Solid state molecular probe device

This paper reviews mass spectrometers based on micro-electro-mechanical systems (MEMS) technology. The MEMS approach to integration is first briefly described, and the difficulties of miniaturizing mass spectrometers are outlined. MEMS components for ionization and mass filtering are then reviewed, together with additional components for ion detection, vacuum pressure measurement and pumping. Mass spectrometer systems containing MEMS sub-components are then described, applications for miniaturized and portable systems are discussed, and challenges and opportunities are presented.

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MEMS Mass Spectrometers: the Next Wave of Miniaturization

Substrates for microchannel plates have been fabricated using Si micromachining techniques. High aspect ratio pores are constructed using reactive ion etching and streaming electron cyclotron resonance etching, and low‐pressure chemical vapor deposition (LPCVD). In one process, 40 μm deep pores with 2 μm openings on 4 μm centers are directly etched in Si. Alternatively, pores with aspect ratios of 30:1 are constructed in a low‐stress SiNx membrane using a sacrificial template process whereby pillars of Si are etched and then subsequently backfilled with a dielectric using LPCVD.

G. W. Tasker

Papers

Fabrication of high aspect ratio structures for microchannel plates