H
H.H. Feng
Researcher at Agency for Science, Technology and Research
Publications - 15
Citations - 184
H.H. Feng is an academic researcher from Agency for Science, Technology and Research. The author has contributed to research in topics: Chip-scale package & Wafer-level packaging. The author has an hindex of 7, co-authored 15 publications receiving 178 citations. Previous affiliations of H.H. Feng include Temasek Polytechnic & Singapore Science Park.
Papers
More filters
Journal ArticleDOI
Enhanced microfiltration devices configured with hydrodynamic trapping and a rain drop bypass filtering architecture for microbial cells detection.
Christophe Lay,Cheng Yong Teo,Liang Zhu,Xue Li Peh,Hong Miao Ji,Bi Rong Chew,Ramana Murthy,H.H. Feng,Wen Tso Liu,Wen Tso Liu +9 more
TL;DR: The new rain drop bypass architecture configuration has a substantially lower pressure drop and allows a better efficiency in trapping protozoan cells (Cryptosporidium parvum and Giardia lamblia) in comparison to the previous generation of a microfilter device.
Proceedings ArticleDOI
Superjunction Power LDMOS on Partial SOI Platform
TL;DR: In this article, a new superjunction power LDMOS structure integrated on the partial SOI (PSOI) platform is proposed, which eliminates the substrate-assisted depletion (SAD) effect completely and enables the making of SJ-LDMOS on bulk silicon substrate without sacrificing its electrical and thermal performance.
Journal ArticleDOI
Ultrasensitive nanowire pressure sensor makes its debut
Bo Woon Soon,Pavel Neuzil,Chee Chung Wong,Chee Chung Wong,Julien Reboud,H.H. Feng,Chengkuo Lee +6 more
TL;DR: In this paper, a membrane pressure sensor with embedded piezoresistive silicon nanowires (NW) has been demonstrated to have an ultra-sensitive response of ( Δ R / R ) / Δ P of 13 Pa −1, achieved through the effective tuning of the transverse electric field across the NW.
Journal ArticleDOI
Cell loss in integrated microfluidic device.
TL;DR: Increased the tubing diameter connecting the sample storage and the micro-device, applying a hydrodynamic focusing approach for sample delivering to reduce cells contacting and adhesion on the walls of micro-channel and chip inlet and optimizing the filter design with a zigzag arrangement of pillars to prolong the effective filter length.
Journal ArticleDOI
Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling
TL;DR: In this article, an ultra-fine-pitch flip-chip interconnect that consists of multiple copper columns (MCCs) and a solder joint is presented, and detailed numerical analysis is conducted on the solder joint fatigue response to various factors such as the Cu-Solder wetting angle, loading direction, and solder geometry parameters.