Power semiconductor devices are key components in power conversion systems. Silicon carbide (SiC) has received increasing attention as a wide-bandgap semiconductor suitable for high-voltage and low-loss power devices. Through recent progress in the crystal growth and process technology of SiC, the production of medium-voltage (600?1700 V) SiC Schottky barrier diodes (SBDs) and power metal?oxide?semiconductor field-effect transistors (MOSFETs) has started. However, basic understanding of the material properties, defect electronics, and the reliability of SiC devices is still poor. In this review paper, the features and present status of SiC power devices are briefly described. Then, several important aspects of the material science and device physics of SiC, such as impurity doping, extended and point defects, and the impact of such defects on device performance and reliability, are reviewed. Fundamental issues regarding SiC SBDs and power MOSFETs are also discussed.

https://iopscience.iop.org/article/10.7567/JJAP.54.040103/pdf

Material science and device physics in SiC technology for high-voltage power devices

The excitation of surface-phonon-polariton (SPhP) modes in polar dielectric crystals and the associ- ated new developments in the field of SPhPs are reviewed. The emphasis of this work is on providing an understand- ing of the general phenomenon, including the origin of the Reststrahlen band, the role that optical phonons in polar dielectric lattices play in supporting sub-diffrac- tion-limited modes and how the relatively long opti- cal phonon lifetimes can lead to the low optical losses observed within these materials. Based on this overview, the achievements attained to date and the potential tech- nological advantages of these materials are discussed for localized modes in nanostructures, propagating modes on surfaces and in waveguides and novel metamaterial designs, with the goal of realizing low-loss nanophoton- ics and metamaterials in the mid-infrared to terahertz spectral ranges.

Low-loss, infrared and terahertz nanophotonics using surface phonon polaritons

Only a few years ago, an account of degradation of silicon carbide high-voltage p-i-n diodes was presented at the European Conference on Silicon Carbide and Related Compounds (Kloster Banz, Germany, 2000). This report was followed by the intense effort of multiple groups utilizing varied approaches and subsequent progress in both fundamental understanding of this phenomenon and its elimination. The degradation of SiC p-i-n junctions is now well documented to be due to the expansion of Shockley-type stacking faults in the part of the devices reached by the electron-hole plasma. The faults can gradually cover most of the junction area, impeding current flow and, as a result, increasing the on-state resistance. While in most semiconductors stacking faults are electrically inactive, in hexagonal silicon carbide polytypes (4H- and 6H-SiC) they form quantum-well-like electron states observed in luminescence and confirmed by first-principles calculations. The stacking-fault expansion occurs via motion of 30° sil...

Degradation of hexagonal silicon-carbide-based bipolar devices

The physical and chemical properties of wide bandgap semiconductors silicon carbide and diamond make these materials an ideal choice for device fabrication for applications in many different areas, e.g. light emitters, high temperature and high power electronics, high power microwave devices, micro-electromechanical system (MEMS) technology, and substrates. These semiconductors have been recognized for several decades as being suitable for these applications, but until recently the low material quality has not allowed the fabrication of high quality devices. Silicon carbide and diamond based electronics are at different stages of their development. An overview of the status of silicon carbide's and diamond's application for high temperature electronics is presented.

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Silicon carbide and diamond for high temperature device applications

The phenomenon of recombination-induced stacking faults in high-voltage p-n diodes in SiC has been previously shown to increase the forward voltage drop due to reduction of minority carrier lifetime. In this paper, it has been shown that, for the first time, this effect is equally important in unipolar devices such as high-voltage MOSFETs. If the internal body diode is allowed to be forward biased during the operation of these devices, then the recombination-induced SFs will reduce the majority carrier conduction current and increase the leakage current in blocking mode. The effect is more noticeable in high-voltage devices where the drift layer is thick and is not expected to impact 600-1200-V devices.

H. Lendenmann

Papers

Crystal Defects as Source of Anomalous Forward Voltage Increase of 4H-SiC Diodes