The development of a compact, solid-state light-emitting diode (LED) that emits at 210 nanometres — the shortest wavelength yet achieved for any type of LED — represents an important step towards achieving exciton-related light-emitting devices and replacing inefficient gas light sources with solid-state light sources. Compact high-efficiency ultraviolet solid-state light sources1—such as light-emitting diodes (LEDs) and laser diodes—are of considerable technological interest as alternatives to large, toxic, low-efficiency gas lasers and mercury lamps. Microelectronic fabrication technologies and the environmental sciences both require light sources with shorter emission wavelengths: the former for improved resolution in photolithography and the latter for sensors that can detect minute hazardous particles. In addition, ultraviolet solid-state light sources are also attracting attention for potential applications in high-density optical data storage, biomedical research, water and air purification, and sterilization. Wide-bandgap materials, such as diamond2 and III–V nitride semiconductors (GaN, AlGaN and AlN; refs 3–10), are potential materials for ultraviolet LEDs and laser diodes, but suffer from difficulties in controlling electrical conduction. Here we report the successful control of both n-type and p-type doping in aluminium nitride (AlN), which has a very wide direct bandgap11 of 6 eV. This doping strategy allows us to develop an AlN PIN (p-type/intrinsic/n-type) homojunction LED with an emission wavelength of 210 nm, which is the shortest reported to date for any kind of LED. The emission is attributed to an exciton transition, and represents an important step towards achieving exciton-related light-emitting devices as well as replacing gas light sources with solid-state light sources.

An aluminium nitride light-emitting diode with a wavelength of 210 nanometres

The III-nitrides include the semiconductors AlN, GaN and InN, which have band gaps spanning the entire UV and visible ranges. Thin films of III-nitrides are used to make UV, violet, blue and green light-emitting diodes and lasers, as well as solar cells, high-electron mobility transistors (HEMTs) and other devices. However, the film growth process gives rise to unusually high strain and high defect densities, which can affect the device performance. X-ray diffraction is a popular, non-destructive technique used to characterize films and device structures, allowing improvements in device efficiencies to be made. It provides information on crystalline lattice parameters (from which strain and composition are determined), misorientation (from which defect types and densities may be deduced), crystallite size and microstrain, wafer bowing, residual stress, alloy ordering, phase separation (if present) along with film thicknesses and superlattice (quantum well) thicknesses, compositions and non-uniformities. These topics are reviewed, along with the basic principles of x-ray diffraction of thin films and areas of special current interest, such as analysis of non-polar, semipolar and cubic III-nitrides. A summary of useful values needed in calculations, including elastic constants and lattice parameters, is also given. Such topics are also likely to be relevant to other highly lattice-mismatched wurtzite-structure materials such as heteroepitaxial ZnO and ZnSe.

https://iopscience.iop.org/article/10.1088/0034-4885/72/3/036502/pdf

X-ray diffraction of III-nitrides

Light-emitting diodes with emission wavelengths less than 400 nm have been developed using the AlInGaN material system. For devices operating at shorter wavelengths, alloy compositions with a greater aluminium content are required. The material properties of these materials lie on the border between conventional semiconductors and insulators, which adds a degree of complexity to the development of efficient light-emitting devices. A number of technical developments have enabled the fabrication of LEDs based on group three nitrides (III-nitrides) that emit in the UV part of the spectrum, providing useful tools for a wealth of applications in optoelectronic systems.

Ultraviolet light-emitting diodes based on group three nitrides

A “visible-blind” solution-processed UV photodetector is realized on the basis of colloidal ZnO nanoparticles. The devices exhibit low dark currents with a resistance >1 TΩ and high UV photocurrent efficiencies with a responsivity of 61 A/W at an average intensity of 1.06 mW/cm2 illumination at 370 nm. The characteristic times for the rise and fall of the photocurrent are <0.1 s and about 1 s, respectively. The photocurrent of the device is associated with a light-induced desorption of oxygen from the nanoparticle surfaces, thus removing electron traps and increasing the free carrier density which in turn reduces the Schottky barrier between contacts and ZnO nanoparticles for electron injection. The devices are promising for use in large-area UV photodetector applications.

Solution-processed ultraviolet photodetectors based on colloidal ZnO nanoparticles.

By alloying GaN with AlN the emission of AlGaN light-emitting diodes can be tuned to cover almost the entire ultraviolet spectral range (210–400 nm), making ultraviolet light-emitting diodes perfectly suited to applications across a wide number of fields, whether biological, environmental, industrial or medical. However, technical developments notwithstanding, deep-ultraviolet light-emitting diodes still exhibit relatively low external quantum efficiencies because of properties intrinsic to aluminium-rich group III nitride materials. Here, we review recent progress in the development of AlGaN-based deep-ultraviolet light-emitting devices. We also describe the key obstacles to enhancing their efficiency and how to improve their performance in terms of defect density, carrier-injection efficiency, light extraction efficiency and heat dissipation. This Review covers recent progress in AlGaN-based deep-ultraviolet light-emitting devices. The key technologies of how to improve their performance, carrier-injection efficiency, light extraction efficiency and heat dissipation are discussed.

The emergence and prospects of deep-ultraviolet light-emitting diode technologies

The need for efficient, compact and robust solid-state UV optical sources and sensors had stimulated the development of optical devices based on III–nitride material system. Rapid progress in material growth, device fabrication and packaging enabled demonstration of high efficiency visible-blind and solar-blind photodetectors, deep-UV light-emitting diodes with emission from 400 to 250 nm, and UV laser diodes with operation wavelengths ranging from 340 to 350 nm. Applications of these UV optical devices include flame sensing; fluorescence-based biochemical sensing; covert communications; air, water and food purification and disinfection; and biomedical instrumentation. This paper provides a review of recent advances in the development of UV optical devices. Performance of state-of-the-art devices as well as future prospects and challenges are discussed.

https://iopscience.iop.org/article/10.1143/JJAP.44.7191/pdf

III-Nitride UV Devices

We report AlGaN deep ultraviolet light-emitting diodes (LEDs) at 250 and 255nm that have short emission wavelengths. For an unpackaged 200×200μm square geometry LED emitting at 255nm, we measured a peak power of 0.57mW at 1000mA of pulsed pump current. For a similar device emitting at 250nm the peak output power of 0.16mW was measured at 300mA of pulsed pump current. Progress is based on the development of high quality AlGaN cladding layers with an Al content up to 72%, which were grown over AlGaN∕AlN superlattice buffer layers on sapphire substrates. These n-Al0.72Ga0.28N layers were doped with Si up to about 1×1018cm−3 and electron mobilities up to 50cm2∕V∙s were estimated. High resolution x-ray diffraction studies gave a narrow (002) rocking curve with full width at half maximum of only 133arcsec.

250nmAlGaN light-emitting diodes

Polarization effects have been studied in GaN/AlGaN multiple quantum wells (MQWs) with different c-axis orientation by means of excitation-dependent photoluminescence (PL) analysis Quantum structures were grown on [0001]-oriented sapphire substrates (C plane) and single-crystalline [1100]-oriented freestanding GaN (M plane) using the metalorganic chemical vapor deposition technique Strong PL spectrum line blueshifts (up to 140 meV) which are correlated with the excitation intensity have been obtained for C-plane MQWs, whereas no shift has been observed for M-plane MQWs Theoretical calculations and comparison with the PL data confirm that the built-in electric field for C-plane structures is much stronger than the field present for M-plane MQWs In the former case, the excitation-induced blueshift of the PL line is due to the screening of the built-in electric field by photoinjected carriers, which is consistent with the field strength of 123 MV/cm in the absence of excitation

/pdf/polarization-effects-in-photoluminescence-of-c-and-m-plane-47f3a8kd97.pdf

Polarization effects in photoluminescence of C- and M-plane GaN/AlGaN multiple quantum wells

Using a micro-pixel design, we report the demonstration of high-power deep UV AlGaN-based light-emitting diodes (LEDs) with peak emission wavelength at 280nm. The design comes in response to lateral current crowding problems, which severely limit the maximum possible active area and the overall performance of ordinary square geometry III-nitride LEDs fabricated on insulating substrates. It is shown that the interconnected micro-pixel geometry significantly reduces both the device series resistance and the thermal impedance, thereby improving heat dissipation and increasing the maximum optical power. The design imparts ever-increasing advantages as the operating wavelength decreases (and the aluminum content increases). The optical power of the 10×10pixel array with an effective area of 222×222μm2 only saturates at dc currents higher than 200mA, which is nearly 50% greater than found for a square geometry LED with identical junction area, fabricated from the same wafer. These 280nm LEDs demonstrated a high...

High-power deep ultraviolet light-emitting diodes basedon a micro-pixel design

We report homoepitaxial GaN growth on freestanding (1100) oriented (M-plane GaN) substrates using low-pressure metalorganic chemical vapor deposition. Scanning electron microscopy, atomic-force microscopy, and photoluminescence were used to study the influence of growth conditions such as the V/III molar ratio and temperature on the surface morphology and optical properties of the epilayers. Optimized growth conditions led to high quality (1100) oriented GaN epilayers with a smooth surface morphology and strong band-edge emission. These layers also exhibited strong room temperature stimulated emission under high intensity pulsed optical pumping. Since for III-N materials the (1100) crystal orientation is free from piezoelectric or spontaneous polarization electric fields, our work forms the basis for developing high performance III-N optoelectronic devices.

/pdf/gan-homoepitaxy-on-freestanding-1100-oriented-gan-substrates-3rpl5weabh.pdf

H. P. Maruska

Papers

III-Nitride UV Devices

250nmAlGaN light-emitting diodes

Polarization effects in photoluminescence of C- and M-plane GaN/AlGaN multiple quantum wells

High-power deep ultraviolet light-emitting diodes basedon a micro-pixel design

GaN Homoepitaxy on Freestanding (11̄00) Oriented GaN Substrates