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Haeng-Ki Lee

Researcher at KAIST

Publications -  252
Citations -  9227

Haeng-Ki Lee is an academic researcher from KAIST. The author has contributed to research in topics: Fly ash & Compressive strength. The author has an hindex of 45, co-authored 251 publications receiving 6513 citations. Previous affiliations of Haeng-Ki Lee include University of Miami & Chosun University.

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Micromechanics-based viscoelastic damage model for particle-reinforced polymeric composites

TL;DR: In this paper, a micromechanics-based viscoelastic damage model was developed to predict the overall visco-elastic behavior of particle-reinforced polymeric composites undergoing damage.
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Numerical characterization of compressive response and damage evolution in laminated plates containing a cutout

TL;DR: In this paper, a micromechanical constitutive model for unidirectional laminated composites is implemented into a finite element program to numerically characterize the compressive response and damage evolution in laminated plates containing a cutout.
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An elastoplastic multi-level damage model for ductile matrix composites considering evolutionary weakened interface

TL;DR: Lee et al. as mentioned in this paper developed an elastoplastic multi-level damage model considering evolutionary weakened interface to predict the effective elastic behavior and multilevel damage evolution in particle reinforced ductile matrix composites (PRDMCs).
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Effect of CaO incorporation on the microstructure and autogenous shrinkage of ternary blend Portland cement-slag-silica fume

TL;DR: In this paper, the effect of CaO incorporation on the microstructure and autogenous shrinkage of ternary blend Portland cement-slag-silica fume was investigated.
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Effect of CNT Agglomeration on the Electrical Conductivity and Percolation Threshold of Nanocomposites: A Micromechanics-based Approach

TL;DR: In this article, the effect of CNT agglomeration on the electrical conductivity and percolation thresholding of nanocomposites was investigated using a micromechanics-based model.