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Hajime Nakagawa

Researcher at Denso

Publications -  5
Citations -  43

Hajime Nakagawa is an academic researcher from Denso. The author has contributed to research in topics: Printed circuit board & Footprint (electronics). The author has an hindex of 2, co-authored 5 publications receiving 43 citations.

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Patent

Connecting structure of printed circuit boards

TL;DR: In this paper, a flexible printed circuit board is electrically connected with a rigid printed circuit through solder, and the solder resist is formed between neighboring two lands on the rigid printed circuits and is terminated with an end portion that is interposed between the rigid circuit board and the flexible circuit board.
Patent

Connecting method and connecting structure of printed circuit boards

TL;DR: In this paper, a flexible printed circuit board is electrically connected with a rigid printed circuit through solder, and the solder resist is formed between neighboring two lands on the rigid printed circuits and is terminated with an end portion that is interposed between the rigid circuit board and the flexible circuit board.
Patent

Verfahren zum Verbinden von gedruckten Leiterplatten

TL;DR: Verfahren zum Verbinden von gedruckten Leiterplatten, mit den Schritten: Bilden einer ersten leitfahigen struktur (13), welche eine erste Mehrzahl von Kontaktflecken (13a) enthalt, auf einer eus einem thermoplastischen Harz hergestellten leiterplatte (5);
Patent

Verbindungsverfahren und Verbindungsstruktur von gedruckten Leiterplatten

TL;DR: In this article, a flexible gedruckte Leiterplatte (5) is shown to be elektrisch verbunden, in which ein Lotmittel resistent (20) zwischen zwei benachbarten Kontaktflecken is gebildet and mit einem endabschnitt raumlich begrenzt.
Patent

Joining two printed circuit boards

TL;DR: In this article, a flexible PCB 2 with lands 11a and 12a is joined to a rigid PCB 5 with lands 13a by solder 14 by a thermo-compression bonding tool.