Takehito Teramae

TL;DR: In this article, a first and second printed circuit board is prepared with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductively pattern with land; overlapping the land of the first board with the ground of the second board is done to form an interconnection portion; and heating the interconnection part at a temperature approximately higher than a glass transition temperature of the thermoplastastic resin, while applying pressure to the interfacement portion to create an electrical interconnection sealed with a part of the insulating

TL;DR: In this paper, a flexible printed circuit board is electrically connected with a rigid printed circuit through solder, and the solder resist is formed between neighboring two lands on the rigid printed circuits and is terminated with an end portion that is interposed between the rigid circuit board and the flexible circuit board.

TL;DR: In this paper, a flexible printed circuit board is electrically connected with a rigid printed circuit through solder, and the solder resist is formed between neighboring two lands on the rigid printed circuits and is terminated with an end portion that is interposed between the rigid circuit board and the flexible circuit board.

TL;DR: In this article, the electrical connecting section for circuit boards is sealed with one part (12a) of resin which represents the insulating substrate (12) of the first board, and the second board has a conductive pattern (11) with a connecting surface (11a).

TL;DR: Verfahren zum Verbinden von gedruckten Leiterplatten, mit den Schritten: Bilden einer ersten leitfahigen struktur (13), welche eine erste Mehrzahl von Kontaktflecken (13a) enthalt, auf einer eus einem thermoplastischen Harz hergestellten leiterplatte (5);