K
Kazuyuki Deguchi
Researcher at Denso
Publications - 7
Citations - 67
Kazuyuki Deguchi is an academic researcher from Denso. The author has contributed to research in topics: Printed circuit board & Footprint (electronics). The author has an hindex of 3, co-authored 7 publications receiving 67 citations.
Papers
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Patent
Method for connecting printed circuit boards and connected printed circuit boards
Toshihiro Miyake,Kazuyuki Deguchi,Yoshitaro Yazaki,Hiroaki Maeda,Mitsutoshi Miyazaki,Makoto Totani,Akinari Higashida,Hiroki Miyagawa +7 more
TL;DR: In this article, a first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern, and the board is heat-pressed to connect the first and second printed circuit boards with a heat-pressing tool.
Patent
Connecting structure of printed circuit boards
Makoto Totani,Toshihiro Miyake,Tomohiro Yokochi,Takehito Teramae,Yoshitaro Yazaki,Kazuyuki Deguchi,Hajime Nakagawa +6 more
TL;DR: In this paper, a flexible printed circuit board is electrically connected with a rigid printed circuit through solder, and the solder resist is formed between neighboring two lands on the rigid printed circuits and is terminated with an end portion that is interposed between the rigid circuit board and the flexible circuit board.
Patent
Connecting method and connecting structure of printed circuit boards
Makoto Totani,Toshihiro Miyake,Tomohiro Yokochi,Takehito Teramae,Yoshitaro Yazaki,Kazuyuki Deguchi,Hajime Nakagawa +6 more
TL;DR: In this paper, a flexible printed circuit board is electrically connected with a rigid printed circuit through solder, and the solder resist is formed between neighboring two lands on the rigid printed circuits and is terminated with an end portion that is interposed between the rigid circuit board and the flexible circuit board.
Patent
Method and structure for connecting printed board
TL;DR: In this paper, the authors propose a method and structure for connecting a printed board which can improve connection reliability by suppressing an excessive flow of thermoplastic resin at a connection place.
Patent
Verfahren zum Verbinden von gedruckten Leiterplatten
Kazuyuki Deguchi,Toshihiro Miyake,Hajime Nakagawa,Takehito Teramae,Makoto Totani,Yoshitaro Yazaki,Tomohiro Yokochi +6 more
TL;DR: Verfahren zum Verbinden von gedruckten Leiterplatten, mit den Schritten: Bilden einer ersten leitfahigen struktur (13), welche eine erste Mehrzahl von Kontaktflecken (13a) enthalt, auf einer eus einem thermoplastischen Harz hergestellten leiterplatte (5);