The present invention comprises a power transmission system, an IC card, and an information communication system using an IC card. In the power transmission system, power is transmitted by radio from the power transmission device to the IC card. In the IC card, the transmitted induced power is converted into a DC voltage, the transmitted induced power or a voltage corresponding to the induced power is detected, and a desired DC voltage to be suppled to the internal circuit is obtained in controlling resistance the detected induced power or the voltage corresponding to the induced power.

Power transmission system, IC card and information communication system using IC card

The invention provides an optical coupling switch and flat panel display including an array of such optical coupling switches. The optical coupling switch includes a light storage plate adapted to set up conditions for total internal reflection such that light injected into the plate is internally reflected. A light tap is disposed proximal to a coupling surface of the light storage plate for coupling internally reflected light out of the light storage plate and into the light tap when the light tap is brought into contact with the light storage plate coupling surface. The light tap is capable of movement in a direction perpendicular to the light storage plate in response to an applied electrostatic force. The optical coupling switch includes a scattering mechanism, such as a scattering surface or scattering medium, for scattering light in the light tap into a viewing volume. With this configuration, the optical coupling switch provides an elegantly uncomplicated geometry that accommodates a range of actuation schemes for efficiently producing high-speed optical switching. Also provided is an optical display in which an array of light taps are disposed proximal to a light storage plate coupling surface. Each light tap is adapted to move in response to an applied electrostatic force in a direction perpendicular to the coupling surface, and each light tap includes a scattering surface for scattering coupled light. A light source is disposed at an edge of the light storage plate for injecting light into the plate. Control circuitry is provided connected to the array of light taps for applying an electrostatic force to selected one or more of the light taps in the array.

Micromechanical optical switch and flat panel display

The present invention provides a novel distributed factory system framework including a novel factory automation lifecycle ( 200 ) having lifecycle activities for SW developing and integrating ( 210 ), installing and administrating ( 220 ), factory modeling ( 230 ), manufacturing planning ( 240 ), manufacturing controlling, monitoring and tracking ( 250 ) and analyzing of manufacturing results ( 260 ). The factory lifecycle comprises framework components. The distributed factory system framework also includes application components and building blocks. The framework components are adapted to for managing the application components, while the application components are utilized to provide instructions for managing a process such as a wafer fab. The building blocks are adapted for forming or modifying framework and application components. The distributed factory system framework provides computer implemented methods for integrating processing systems and facilitates process and equipment changes.

Computer integrated manufacturing techniques

A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body (150) having a conditioning surface that engages a planarizing surface (128) of the planarizing medium and is movable relative to the planarizing medium. A force sensor (180) is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device (193) that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

A connector is provided which includes a fiber optic connector having a polymer ferrule (331, 332) having multiple fibers mounted in V-grooves (336) of the ferrule (331, 332) and beveled edges (335a, 335b) of the ferrule providing for alignment of the ferrule (331, 332) when the fiber optic connector is mated to a receptacle (500) having an alignment assembly and an alignment member mounted within the alignment assembly to provide for precision alignment. A receptacle assembly is provided having a first receptacle half (400) for receiving a fiber optic connector having a first form factor and a second receptacle half (300) for receiving a fiber optic connector having a second form factor. A fiber optical ferrule is also provided having a pair of mutually opposing ferrule halves (331, 332) that join to define a fiber optical support region that receives optical fibers, where at least one of the ferrule halves (331, 332) includes a vertically aligned wall (380, 390) that protrudes toward the opposing ferrule half.

Massive parallel optical interconnect system

An optical integrated circuit and an optical apparatus used in optical communication or an opto-electronics apparatus such as an optical disk recording apparatus, in which various kinds of aberration caused by wavelength variation of a light source when a semiconductor laser is used as the light source. An aberration correcting grating having such grating pitches as to nearly satisfy the Bragg condition preferably with respect to a certain wavelength of the semiconductor laser beam is used. As a result, lowering of incidence (entrance) and radiation (exit) coupling efficiencies of the grating coupler and aberration such as chromatic aberration can be prevented. Even if a multi-mode semiconductor laser is used as a light source, the characteristics of the optical integrated circuit and optical apparatus do not vary largely.

Optical integrated circuit and optical apparatus

Laser sources output laser lights L1 and L2 having different wavelengths so as to increase an accuracy of an endpoint detection of polishing processing by enabling an accurate detection of a film thickness of a layer insulating film on a surface of a wafer to be polished by the CMP processing, the lights are emitted from a detection window via a beam splitter to the layer insulating film formed on the surface of the wafer to be polished by a pad, different optical detectors detect interference lights corresponding to the laser lights L1 and L2 reflected and generated from a surface of the layer insulating film and a pattern under the surface via the detection window, the beam splitter, and a dichroic mirror, the detection results are supplied to a film thickness evaluation unit 7, a film thickness of the layer insulation film is detected on the basis of a relationship between intensities of the reflected interference lights to the laser lights L1 and L2 or the intensity ratio, and an endpoint of polishing processing is determined when the film thickness is equal to a predetermined value.

Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same

A sample is located so as to be close to a prism and a light beam coming from a light source is projected to the prism while varying the incident angle to the prism as a parameter. The incident light beam to the prism is propagated therein and light emerging from the bottom surface of the prism, which is in contact with the sample, is projected to the sample. At the same time the intensity of light reflected by the bottom surface of the prism is measured. Optical constants such as the refractive index, the film thickness, the distribution of the refractive index, etc. are obtained by calculation, starting from measured values thus obtained.

Method and apparatus for measuring optical constants of a thin film as well as method and apparatus for fabricating a thin film utilizing same

A method of and an apparatus for molding a plastic wherein the injection pressure (transfer pressure) is switched to a holding pressure when the internal pressure of the mold cavity sensed by a pressure sensor reaches a predetermined injection pressure (transfer pressure), to initiate holding of the pressure applied to the cavity. The holding pressure is removed when the internal pressure thereof becomes zero or in accordance with the detection of a predetermined inflection point in the internal pressure which is indicative of a gate sealing point in the mold cavity or is brought to a predetermined value close to zero. The molded articles are of high precision finishes, and conservation of energy and natural resources can be achieved.

Apparatus for molding plastic

A connector means includes a connector housing provided with a plurality of bores which is defined by a pair of plastic bases each having a plurality of hemicycle grooves each of which has an inner diameter 1 to several μm larger than an outer diameter of each of the optical cables to be connected. After the optical fibres are inserted into the respective bores and secured therein, one end surface of the connector housing is polished. A pair of connected housings are retained so that the polished end surfaces abut on each other thereby to attain a connection between a plurality of optical cables.

Hidemi Sato

Papers

Optical integrated circuit and optical apparatus

Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same

Method and apparatus for measuring optical constants of a thin film as well as method and apparatus for fabricating a thin film utilizing same

Apparatus for molding plastic

Method for assembling flat type plastic multifiber connectors