Transparent electronics is today one of the most advanced topics for a wide range of device applications. The key components are wide bandgap semiconductors, where oxides of different origins play an important role, not only as passive component but also as active component, similar to what is observed in conventional semiconductors like silicon. Transparent electronics has gained special attention during the last few years and is today established as one of the most promising technologies for leading the next generation of flat panel display due to its excellent electronic performance. In this paper the recent progress in n- and p-type oxide based thin-film transistors (TFT) is reviewed, with special emphasis on solution-processed and p-type, and the major milestones already achieved with this emerging and very promising technology are summarizeed. After a short introduction where the main advantages of these semiconductors are presented, as well as the industry expectations, the beautiful history of TFTs is revisited, including the main landmarks in the last 80 years, finishing by referring to some papers that have played an important role in shaping transparent electronics. Then, an overview is presented of state of the art n-type TFTs processed by physical vapour deposition methods, and finally one of the most exciting, promising, and low cost but powerful technologies is discussed: solution-processed oxide TFTs. Moreover, a more detailed focus analysis will be given concerning p-type oxide TFTs, mainly centred on two of the most promising semiconductor candidates: copper oxide and tin oxide. The most recent data related to the production of complementary metal oxide semiconductor (CMOS) devices based on n- and p-type oxide TFT is also be presented. The last topic of this review is devoted to some emerging applications, finalizing with the main conclusions. Related work that originated at CENIMAT|I3N during the last six years is included in more detail, which has led to the fabrication of high performance n- and p-type oxide transistors as well as the fabrication of CMOS devices with and on paper.

Oxide Semiconductor Thin‐Film Transistors: A Review of Recent Advances

https://iopscience.iop.org/article/10.1088/1468-6996/11/4/044305/pdf

Present status of amorphous In–Ga–Zn–O thin-film transistors

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

We review the features of amorphous In-Ga-Zn-O (a-IGZO) thin-film transistors (TFTs), as well as circuit operation based on these TFTs. We also report a novel TFT structure which improves environmental stability of the TFT operation by taking full advantage of the a-IGZO properties, where a conventional PECVD a-SiNX:H films serve not only as an effective barrier layer but also as a hydrogen source to form the coplanar source and drain.

42.1: Invited Paper: Improved Amorphous In‐Ga‐Zn‐O TFTs

Thin-film electronics in its myriad forms has underpinned much of the technological innovation in the fields of displays, sensors, and energy conversion over the past four decades. This technology also forms the basis of flexible electronics. Here we review the current status of flexible electronics and attempt to predict the future promise of these pervading technologies in healthcare, environmental monitoring, displays and human-machine interactivity, energy conversion, management and storage, and communication and wireless networks.

Flexible Electronics: The Next Ubiquitous Platform

Five-stage ring oscillators (ROs) composed of amorphous In/Ga/Zn/O (a-IGZO) channel thin-film transistors (TFTs) with the channel lengths of 10 mum were fabricated on a glass substrate. The a-IGZO layer was deposited by RF magnetron sputtering onto the unheated substrate. The RO operated at 410 kHz (the propagation delay of 0.24 mus/stage), when supplied with an external voltage of +18 V. This is the fastest integrated circuit based on oxide-semiconductor channel TFTs to date that operates faster than the ROs using conventional hydrogenated amorphous silicon TFTs and organic TFTs

Fast Thin-Film Transistor Circuits Based on Amorphous Oxide Semiconductor

This paper presents the following recent investigations of transparent amorphous-oxide semiconductors (TAOS) from materials to devices and circuits. 1) Composition of metals in TAOS are widely explored with the aim of seeking semiconductors suitable for the channel layers of thin-film transistors (TFTs) composing backplanes for flat-panel displays. It is found in combinatorial approaches to the materials exploration that indium-based ternary TAOS (In-X-O) and their TFTs show the properties and the performance as good as those of the most popular material of amorphous In-Ga-Zn-O (alpha-IGZO) when X = Zn or Ge. 2) Defects and impurities in TAOS are investigated by theoretical approaches. The first-principle calculation of the electron states reveals that charge-neutral oxygen vacancy or interstitial forms the density of states around mid-gap level and does not generate carriers directly, while hydrogen impurity raises the Fermi level beyond the conduction-band minimum and acts as a donor in TAOS. 3) Device structures of TAOS-TFTs are also investigated extensively for better performance and stability. It is found in channel-etch type TFTs with bottom-gate inverse-stagger structures that the TFT characteristics and stability are significantly improved by chemically removing the back-channel layer in a wet-etching process. Coplanar homojunction (CH) structure is proposed as a novel device structure where conductive alpha-IGZO regions work as the source and drain electrodes to the channel region of semiconductor alpha-IGZO. The CH TFTs show excellent characteristics and stability, with low series resistance without any difficulty in making good electrical contact between metals and TAOS. 4) Circuits using TAOS-TFTs are demonstrated. A ring oscillator composed of fifteen-stage inverters with a buffer circuit operates as designed by circuit simulation with a TFT model for hydrogenated amorphous Si TFTs. Pixel circuits composed of three TFTs and one transparent capacitor successfully drive organic light-emission diode cells without a planarization layer on a 2-in diagonal panel having 176 times144 times 3 pixels.

Materials, Devices, and Circuits of Transparent Amorphous-Oxide Semiconductor

In a method of treating a semiconductor element which at least includes a semiconductor, a threshold voltage of the semiconductor element is changed by irradiating the semiconductor with light with a wavelength longer than an absorption edge wavelength of the semiconductor. The areal density of in-gap states in the semiconductor is 10 13 cm -2 eV -1 or less. The band gap may be 2 eV or greater. The semiconductor may include at least one selected from the group consisting of In, Ga, Zn and Sn. The semiconductor may be one selected from the group consisting of amorphous In-Ga-Zn-O (IGZO), amorphous In-Zn-O (IZO) and amorphous Zn-Sn-O (ZTO). The light irradiation may induce the threshold voltage shift in the semiconductor element, the shift being of the opposite sign to the threshold voltage shift caused by manufacturing process history, time- dependent change, electrical stress or thermal stress.

Method of treating semiconductor element

Disclosed is a method of driving a transistor including a semiconductor layer, a first insulating layer, a second insulating layer, a first conductive layer, and a second conductive layer such that the semiconductor layer is disposed between the first and second insulating layers, one surface of the first insulating layer opposite the other surface in contact with the semiconductor layer is in contact with the first conductive layer, one surface of the second insulating layer opposite the other surface in contact with the semiconductor layer is in contact with the second conductive layer. The method includes applying a voltage VBG that satisfies the relation of VBG≦VON 1 ×C 1 /(C 1 +C 2 ) to the second conductive layer.

Method of driving transistor and device including transistor driven by the method

Compatibility of high sensitivity with low remaining images, and low crosstalk can be achieved by a laminated solid-state image pickup device, which includes accumulating portions for accumulating electric signals, reading units for reading the electric signals, connecting members formed in contact with the accumulating portions, and a photoconductive film, and by a method for manufacturing the device. The photoconductive film is made of a non-crystalline semiconductor, and is configured by laminating a carrier multiplication layer, a light absorbing layer, a charge injection inhibiting layer of a second conduction type. Each of the connecting members is made of a semiconductor layer of a first conduction type, intrinsic or having a low impurity density, surrounded by a semiconductor layer of the second conduction type or a conductive material.

Hisae Shimizu

Papers

Fast Thin-Film Transistor Circuits Based on Amorphous Oxide Semiconductor

Materials, Devices, and Circuits of Transparent Amorphous-Oxide Semiconductor

Method of treating semiconductor element

Method of driving transistor and device including transistor driven by the method

Laminated solid-state image pickup device