Provided is a light emitting diode (LED) manufactured by using a wafer bonding method and a method of manufacturing a LED by using a wafer bonding method. The wafer bonding method may include interposing a stress relaxation layer (33) formed of a metal between a semiconductor layer (20) and a bonding substrate (31). When the stress relaxation layer is used, stress between the bonding substrate and a growth substrate may be offset due to the flexibility of metal, and accordingly, bending or warpage of the bonding substrate may be reduced or prevented.

Light-emitting device and method of manufacturing the same

A nitride semiconductor device including a light emitting device comprises a n-type region of one or more nitride semiconductor layers having n-type conductivity, a p-type region of one or more nitride semiconductor layers having p-type conductivity and an active layer between the n-type region and the p-type region. In such devices, there is provided with a super lattice layer comprising first layers and second layers which are nitride semiconductors having a different composition respectively. The super lattice structure makes working current and voltage of the device lowered, resulting in realization of more efficient devices.

Nitride semiconductor device

A transition crystal structure is disclosed for providing a good lattice and thermal match between a layer of single crystal silicon carbide (25) and a layer of single crystal gallium nitride (24). The transition structure comprises a buffer formed of a first layer of gallium nitride and aluminum nitride (22), and a second layer of gallium nitride and aluminum nitride (23) adjacent to the first layer. The mole percentage of aluminum nitride in the second layer (23) is substantially different from the mole percentage of aluminum nitride in the first layer (22). A layer of single crystal gallium nitride (24) is formed upon the second layer of gallium nitride and aluminum nitride. In preferred embodiments, the buffer further comprises an epitaxial layer of aluminum nitride upon a silicon carbide substrate.

Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices

A double heterostructure for a light emitting diode comprises a layer of aluminum gallium nitride having a first conductivity type; a layer of aluminum gallium nitride having the opposite conductivity type; and an active layer of gallium nitride between the aluminum gallium nitride layers, in which the gallium nitride layer is co-doped with both a Group II acceptor and a Group IV donor, with one of the dopants being present in an amount sufficient to give the gallium nitride layer a net conductivity type, so that the active layer forms a p-n junction with the adjacent layer of aluminum gallium nitride having the opposite conductivity type.

Double heterojunction light emitting diode with gallium nitride active layer

A light-emitting gallium nitride-based compound semiconductor device of a double-heterostructure. The double-heterostructure includes a light-emitting layer formed of a low-resistivity In x Ga 1-x N (0<x<1) compound semiconductor doped with p-type and/or n-type impurity. A first clad layer is joined to one surface of the light-emitting layer and formed of an n-type gallium nitride-based compound semiconductor having a composition different from the light-emitting layer. A second clad layer is joined to another surface of the light-emitting layer and formed of a low-resistivity, p-type gallium nitride-based compound semiconductor having a composition different from the light-emitting layer.

Light-emitting gallium nitride-based compound semiconductor device

Disclosed herein is a light-emitting semiconductor device that includes a gallium nitride compound semiconductor (AlxGa1-xN) comprising an n-layer and an i-layer, at least one of them being of a double layer structure. In one embodiment the n-layer has a double-layer structure including an n-layer of a low carrier concentration and an n+-layer of a high carrier concentration, the former being adjacent to the i-layer. In another embodiment, the i-layer has a double-layer structure including an iL-layer of a low impurity concentration containing p-type impurities in a comparatively low concentration and an iH-layer of a high impurity concentration containing p-type impurities in a comparatively high concentration, the former being adjacent to the n-layer. In still another embodiment, both of the n-layer and the i-layer have a double layer structure. Also disclosed is a method for producing the light-emitting semiconductor device which employs a vapor phase epitaxy. In one preferred method, an n-type gallium nitride compound semiconductor (AlxGA1-xN) having a controlled conductivity is produced from an organometallic compound by vapor phase epitaxy, by feeding a silicon-containing gas together with other raw material gases at a controlled mixing ratio.

Light emitting semiconductor device using gallium nitride group compound

A substrate for producing a gallium nitride compound-semiconductor (Al.su Ga1-x N; X=0 inclusive) device in vapor phase on a sapphire substrate using gaseous organometallic compound, and a also blue light emitting diode produced by using the substrate. The buffer layer comprising aluminium nitride (AlN) and having a crystal structure where microcrystal or polycrystal is mixed in amorphous state, is formed on the sapphire substrate. The buffer layer is formed at a growth temperature of 380° to 800° C. to have a thickness of 100 to 500 Å. Further, on the buffer layer is formed the layer of gallium nitride compound-semiconductor (Alx Ga1-x N; X=0 inclusive). The layer of gallium nitride compound-semiconductor (Alx Ga1-x N; X=0 inclusive) comprising at least two layers having different conductive types and being sequentially layered on the buffer layer, functions as a light emitting layer. The existence of the buffer layer having the aforementioned structure greatly contributes on the improved high-quality single crystal of the gallium nitride compound-semiconductor. On the other hand, the blue light emitting property is also improved due to the increase of the quality.

Substrate for growing gallium nitride compound-semiconductor device and light emitting diode

Disclosed herein are (1) a light-emitting semiconductor device that uses a gallium nitride compound semiconductor (Al x Ga 1-x N) in which the n-layer of n-type gallium nitride compound semiconductor (Al x Ga 1-x N) is of double-layer structure including an n-layer of low carrier concentration and an n + -layer of high carrier concentration, the former being adjacent to the i-layer of insulating gallium nitride compound semiconductor (Al x Ga 1-x N); (2) a light-emitting semiconductor device of similar structure as above in which the i-layer is of double-layer structure including an i L -layer of low impurity concentration containing p-type impurities in comparatively low concentration and an i H -layer of high impurity concentration containing p-type impurities in comparatively high concentration, the former being adjacent to the n-layer; (3) a light-emitting semiconductor device having both of the above-mentioned features and (4) a method of producing a layer of an n-type gallium nitride compound semiconductor (Al x Ga 1-x N) having a controlled conductivity from an organometallic compound by vapor phase epitaxy, by feeding a silicon-containing gas and other raw material gases together at a controlled mixing ratio.

Light-emitting semiconductor device using gallium nitride group compound with double layer structures for the n-layer and/or the i-layer

An Al 0.15 Ga 0.85 N layer 2 is formed on a silicon substrate 1 in a striped or grid pattern. A GaN layer 3 is formed in regions A where the substrate 1 is exposed and in regions B which are defined above the layer 2 . At this time, the GaN layer grows epitaxially and three-dimensionally (not only in a vertical direction but also in a lateral direction) on the Al 0.15 Ga 0.85 N layer 2 . Since the GaN layer grows epitaxially in the lateral direction as well, a GaN compound semiconductor having a greatly reduced number of dislocations is obtained in lateral growth regions (regions A where the substrate 1 is exposed).

Hisaki Kato

Papers

Light emitting semiconductor device using gallium nitride group compound

Substrate for growing gallium nitride compound-semiconductor device and light emitting diode

Light-emitting semiconductor device using gallium nitride group compound with double layer structures for the n-layer and/or the i-layer

Method for manufacturing a gallium nitride group compound semiconductor

Substrat zum wachsenlassen eines galliumnitridverbindung-halbleiterbauelements und lichtemitterdiode