H
Hormazdyar M. Dalal
Researcher at IBM
Publications - 40
Citations - 1875
Hormazdyar M. Dalal is an academic researcher from IBM. The author has contributed to research in topics: Layer (electronics) & Copper interconnect. The author has an hindex of 22, co-authored 40 publications receiving 1875 citations. Previous affiliations of Hormazdyar M. Dalal include GlobalFoundries.
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Patent
Refractory metal capped low resistivity metal conductor lines and vias
TL;DR: In this paper, the authors defined the notion of a columnar structure of a metalization, which is defined as a low resistivity metal or alloy encapsulated by a refractory metal having a resistivity greater than that of the low-resilience metal and having a common composition, and all the sides of the plurality of sides being formed within the opening in the at least one dielectric layer.
Patent
Method of making an edge seal for a semiconductor device
Birendra N. Agarwala,Hormazdyar M. Dalal,Eric G. Liniger,Diana Llera-Hurlburt,Du Binh Nguyen,Richard W. Procter,Hazara S. Rathore,Chunyan E. Tian,Brett H. Engel +8 more
TL;DR: An edge seal around the periphery of an integrated circuit device which environmentally protects the copper circuitry from cracks that may form in the low-k interlevel dielectric during dicing was proposed in this article.
Patent
Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
Hazara S. Rathore,Hormazdyar M. Dalal,Paul S. McLaughlin,Du B. Nguyen,Richard G. Smith,Alexander J. Swinton,Richard A. Wachnik +6 more
TL;DR: In this article, double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.
Patent
Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
TL;DR: In this article, a structure and method for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability is disclosed for direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy.
Patent
Flip chip attach on flexible circuit carrier using chip with metallic cap on solder
TL;DR: In this paper, a structure and method for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability is disclosed for direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy.