Apparatus for determining a best trajectory for laser CVD through a strategy of acquiring a series of two-dimensional plane images of the substrate. These images, taken together, contain topographical information as well as local reflectivity and thermal mapping information. The images are combined in digital format with additional substrate mapping information to calculate a best three-dimensional trajectory for the desired laser operation. The technique is especially suitable for compensation of tilt or severe height variation on microelectronic parts. The apparatus can deposit platinum conductors on integrated circuits by pyrolytic deposition from Pt(PF3)4 vapor.

Image-based three-axis positioner for laser direct write microchemical reaction

An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.

Method for creating s/tem sample and sample structure

The present invention discloses a novel method for interlayer corrections for photolithographic patterns that are reproduced on a wafer surface capable of correcting not only the optically-induced proximity effect but also the process-induced proximity effect. In the method, a conventional optical proximity correction is first performed on a photomask, the corrected photomask is then used to produce a pattern on a wafer surface. The various critical dimensions bias values at a multiplicity of locations are then measured and fed back to the computer aided design data file for the photomask for producing patterns that are corrected for both optically-induced and process-induced proximity effect on a wafer surface.

Interlayer method utilizing CAD for process-induced proximity effect correction

An improved method and apparatus for extracting and handling samples for S/TEM analysis. Preferred embodiments of the present invention make use of a micromanipulator and a hollow microprobe probe using vacuum pressure to adhere the microprobe tip to the sample. By applying a small vacuum pressure to the lamella through the microprobe tip, the lamella can be held more securely and its placement controlled more accurately than by using electrostatic force alone. By using a probe having a beveled tip and which can also be rotated around its long axis, the extracted sample can be placed down flat on a sample holder. This allows sample placement and orientation to be precisely controlled, thus greatly increasing predictability of analysis and throughput.

Method and apparatus for sample extraction and handling

An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.

Method for s/tem sample analysis

A method for compensation for the proximity effect in electron beam lithography on an e-beam resist material. The exposed surface of the resist material is subdivided into non-overlapping pixels of approximately equal area, with a first set of pixels representing a selected pattern for e-beam lithography and a second set of pixels including all other pixels. The cumulative exposure for each pixel in the first set is computed by adding to the direct beam exposure of that pixel the contributions of spillover (backscattering) exposure arising from exposure of nearby pixels in the second set. The cumulative exposure for each pixel in the second set is computed by adding to the reduced beam exposure of that pixel the contributions of spillover exposure arising from exposure of nearby pixels in the second set. The resist material is then irradiated, pixel-by-pixel with a fixed electron beam radius, with the exposure at each pixel being equal to the cumulative exposure computed for that pixel.

Single pass compensation for electron beam proximity effect

In electron beam lithography, resolution is limited by two important factors: proximity effect and resist contrast. The relation between these two factors is investigated in a chemically amplified negative resist system. It has been discovered that proximity effect induced critical dimensions variation is not monotonically dependent on resist contrast; the worst proximity effects are apparent at medium contrast values. At higher contrast values, increasing the contrast can reduce the proximity effect; at lower values, increasing the contrast worsens the proximity effect. It has also been found that a parabola‐shaped curve is obtained when interproximity effect is plotted as a function of exposure dose. Dissolution rate ratio and overdevelopment effect were used to explore the impact of resist contrast on e‐beam proximity effect.

Hua-yu Liu

Papers

Single pass compensation for electron beam proximity effect

The effect of resist contrast on linewidth error induced by e‐beam proximity exposure