In this paper, insulated gate bipolar transistor (IGBT) models published in the literature are reviewed, analyzed, compared and classified into different categories according to mathematical type, objectives, complexity, accuracy and speed. Features of the different models are listed. Different modeling criteria are discussed according to various circuit conditions, structures, thermal considerations and accuracies. Some problems and trends in IGBT modeling are discussed.

A review of IGBT models

A compact circuit simulator model is used to describe the performance of a 2-kV, 5-A 4-H silicon carbide (SiC) power DiMOSFET and to perform a detailed comparison with the performance of a widely used 400-V, 5-A Si power MOSFET. The model's channel current expressions are unique in that they include the channel regions at the corners of the square or hexagonal cells that turn on at lower gate voltages and the enhanced linear region transconductance due to diffusion in the nonuniformly doped channel. It is shown that the model accurately describes the static and dynamic performance of both the Si and SiC devices and that the diffusion-enhanced channel conductance is essential to describe the SiC DiMOSFET on-state characteristics. The detailed device comparisons reveal that both the on-state performance and switching performance at 25degC are similar between the 400-V Si and 2-kV SiC MOSFETs, with the exception that the SiC device requires twice the gate drive voltage. The main difference between the devices is that the SiC has a five times higher voltage rating without an increase in the specific on-resistance. At higher temperatures (above 100degC), the Si device has a severe reduction in conduction capability, whereas the SiC on-resistance is only minimally affected

Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence

The current state of wide bandgap device technology is reviewed and its impact on power electronic system miniaturization for a wide variety of voltage levels is described. A synopsis of recent complementary technological developments in passives, integrated driver, and protection circuitry and electronic packaging are described, followed by an outline of the applications that stand to be impacted. A glimpse into the future based on the current technological trends is offered.

Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

Characterization and Modeling of High-Switching-Speed Behavior of SiC Active Devices

The current status of research in the field of power semiconductor device models is reviewed. For this purpose, the basic modeling problems and research issues, which have to be overcome in this field, are discussed. Some new and quite promising modeling concepts have been proposed, which are compared with more traditional ways of achieving an efficient tradeoff between the necessary accuracy, required simulation speed, and feasibility of parameter determination. From this comparison, a prediction of the future evolution of circuit simulation models for power semiconductor devices naturally emerges. Many of the different concepts are expected to survive only in an application niche, where their specific points of strength are important. However, three modeling concepts have already been proven to be successfully applicable to the complete spectrum of power semiconductor devices and have their strength for different grades of complexity of the power circuit. A revolutionary development from anticipated or long-due breakthroughs is on the other hand not expected in the foreseeable future.

Status and trends of power semiconductor device models for circuit simulation

The power MOSFET model performance required for accurate waveform simulation is evaluated for most power converter circuits. Three models are thoroughly evaluated through C-V plots, gate charge plots and power converter data. A procedure is given for evaluating any proprietary model using data book information with three simple simulations.

Performance requirements for power MOSFET models

A fundamentally new, physically-based power MOSFET model features continuous and accurate curves for all three interelectrode capacitances. The model equations are derived from the charge stored on two internal nodes and the three external terminals. A straightforward parameter extraction technique uses the standard gate-charge plot or process data and is matched with interelectrode capacitance measurements. Simulations are in excellent agreement with measurements. The model is used to design a snubber for a flyback converter. >

The lumped-charge power MOSFET model, including parameter extraction

Model validation for power semiconductor devices is classified into five levels with model performance features and applications defined for each level. The five levels for each device correspond to: basic, accurate, thermal, failure and degradation models. Whenever they exist, examples of device models are identified for each power semiconductor device.

I. Budihardjo

Papers

Performance requirements for power MOSFET models

The lumped-charge power MOSFET model, including parameter extraction

Defining standard performance levels for power semiconductor devices