In the laser treatment of a workpiece (9), e.g. for surface hardening, melting, alloying, cladding, welding or cutting, the adverse effect of reflectivity of the surface, when a pure, monochromatic laser (6) is used, is remedied by the simultaneous application of a relatively shorter wavelength beam (1). The two beams (1)(5) may be combined by a beam coupler (4) or may reach the workpiece (9) by separate optical paths (not shown). The shorter wavelength beam (1) improves the coupling efficiency of the higher- powered laser beam (5).

Laser Material Processing

Effect of water absorption on the mechanical properties of hemp fibre reinforced unsaturated polyester composites

The objective of this review is to study interfacial reactions between pure Sn or Sn-rich solders, and common base metals used in Pb-free electronics production. In particular, the reasons leading to the observed interfacial reactions products and their metallurgical evolution have been analyzed. Results presented in the literature have been critically evaluated with the help of combined thermodynamic–kinetic approach based on the concept of local equilibrium and microstructural knowledge. The following conclusions have been reached: Firstly, the formations of intermetallic compounds in solid/liquid reaction couples are primarily controlled by the dissolution processes of base metals. Other factors that need be considered are the thermodynamic driving force for the formation of intermetallic compounds, their structures and concentration profiles in liquid. Secondly, annealing of solder interconnections in solid state can drastically change the microstructures formed in the solid/liquid reactions, especially if only one of the components in the solder takes part in the interfacial reactions. Thirdly, additional elements can have three major effects on the binary reactions between a base metal and Sn: (i) they can increase or decrease the reaction/growth rates, (ii) the additives can change the physical properties of the phases formed, and (iii) they can form additional reaction products or displace the binary equilibrium phases by forming new reaction products. Finally, if the local stable or metastable equilibrium is established at the interface, stability information together with kinetic considerations can provide a feasible approach to analyze interfacial reactions, which can have significant impact on the reliability of soldered electronics assemblies.

Interfacial reactions between lead-free solders and common base materials

https://research.birmingham.ac.uk/portal/files/20583243/Oliveux_Dandy_Leeke_Current_status_recycling_fibre_Progress_Materials_Science_2015.pdf

Current status of recycling of fibre reinforced polymers: Review of technologies, reuse and resulting properties

Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.

Advances in lead-free electronics soldering

Hygrothermal effects of epoxy resin. Part I: the nature of water in epoxy

Hygrothermal effects of epoxy resin. Part II : Variations of glass transition temperature

Single shear lap joints were made with four different solders, Sn-Pb and Sn-Ag eutectic solders, and their composites containing about 20 vol.% in-situ Cu6Sn5 intermetallic phases about 3–8 micrometers in diameter. Two sets of experiments were performed: In the first set, all of the above four solder joints were aged at 150°C for periods ranging to 5000 h and the intermetallic growth was monitored periodically. In the second set, each of the above four solder joints was aged at five different temperatures for 4000 h. The interfacial layers between solders and the Cu substrate were examined using optical and scanning electron microscopy. The growth kinetics of intermetallic interfacial layers formed between solder and Cu substrate was characterized. The effect of in-situ Cu6Sn5 intermetallic phases on the growth rate is discussed. The growth rate of the intermetallic layers in the eutectic Sn-Pb composite was slower for the first 150 h as compared to the eutectic Sn-Pb non-composite. The growth rate of the intermetallic layers were similar for both the eutectic Sn-Ag and eutectic Sn-Ag composite throughout the aging duration. The activation energies for Cu6Sn5 layer growth for the eutectic Sn-Pb and Sn-Ag solder joints are evaluated to be 111 kJ/mol and 116 kJ/mol, respectively. The eutectic Sn-Pb and Sn-Ag composite solder joints exhibit higher activation energies of 161 kJ/mol and 203 kJ/mol.

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

The effects of a water environment on anomalous absorption behavior in graphite/epoxy composites

Grain-boundary deformation is the primary failure mode observed in solder joints. Understanding the effects of alloy composition variations and cooling rates on microstructural stability and deformation processes will allow development of improved joints. The effects of these variables on grain-boundary character were investigated in a pure-tin ingot and a reflowed sample; ingots of Sn-3.5wt.%Ag and Sn-3.8wt.%Ag-0.7wt.%Cu; and solder balls with 1.63-wt.% or 3-wt.%Ag. The microstructure was characterized using orientation imaging microscopy (OIM). After aging (150°C for 200 h), the fine-grained polycrystalline microstructure in both pure-tin specimens grew considerably, revealing preferred misorientations and ledge formation at grain boundaries. Aging of the alloy ingots showed only slight grain growth caused by precipitate pinning. The solder balls showed similar phenomena. The role of alloying elements, cooling rate, and the anisotropy of the coefficient of thermal expansion (CTE) in tin on microstructural evolution, grain-boundary character, and properties of solder joints are discussed.

J. P. Lucas

Papers

Hygrothermal effects of epoxy resin. Part I: the nature of water in epoxy

Hygrothermal effects of epoxy resin. Part II : Variations of glass transition temperature

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

The effects of a water environment on anomalous absorption behavior in graphite/epoxy composites

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys