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Eric J. Cotts
Researcher at Binghamton University
Publications - 92
Citations - 2495
Eric J. Cotts is an academic researcher from Binghamton University. The author has contributed to research in topics: Soldering & Intermetallic. The author has an hindex of 22, co-authored 89 publications receiving 2298 citations.
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Journal ArticleDOI
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
Abstract: The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints were examined. A clear dependence of the thermomechanical fatigue response of these solder joints on Sn grain orientation was observed (Sn has a body centered tetragonal crystal structure). Fabricated joints tend to have three orientations in a cyclic twin relationship, but among the population of solder balls, this orientation triplet appears to be randomly oriented. In thermally cycled joints, solder balls with dominant Sn grains having the particular orientation with the c-axis nearly parallel to the plane of the substrate were observed to fail before neighboring balls with different orientations. This results from the fact that the coefficient of thermal expansion of Sn in the basal plane (along the alpha-axis) is half the value along the c-axis; joints observed to be damaged had the maximum coefficient of thermal expansion mismatch between solder and substrate at the joint interface, as well as a tensile stress modes during the hot part of the thermal cycle. Localized recrystallization was observed in regions of maximum strain caused by differential expansion conditions, and its connection with crack nucleation is discussed.
Journal ArticleDOI
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
Donald W. Henderson,James John Woods,Timothy A. Gosselin,Jay Bartelo,David E. King,T.M. Korhonen,Matt A. Korhonen,L.P. Lehman,Eric J. Cotts,Sung K. Kang,Paul A. Lauro,Da-Yuan Shih,Charles C. Goldsmith,Karl J. Puttlitz +13 more
TL;DR: In this article, the solder joint fatigue process is characterized by the recrystallization of the Sn phase in the higher deformation regions with the production of a much smaller grain size.
Journal ArticleDOI
Cyclic twin nucleation in tin-based solder alloys
TL;DR: In this article, the cyclic growth twinning of Sn grains during solidification from the melt was observed in Sn-Ag, SAC, and Sn-Cu solders.
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Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
L.P. Lehman,S. N. Athavale,T. Z. Fullem,A. C. Giamis,R. Kinyanjui,Margaret Lowenstein,K. Mather,R. Patel,D.F. Rae,J. Wang,Y. Xing,L. Zavalij,Peter Borgesen,Eric J. Cotts +13 more
TL;DR: In this article, the microstructure of the Sn-Ag-Cu solder was examined by optical microscopy and scanning electron microscopy (SEM) for various compositions near the ternary eutectic for different cooling rates from the solder melt.
Journal ArticleDOI
Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys
Adwait U. Telang,Thomas R. Bieler,J. P. Lucas,K. N. Subramanian,L.P. Lehman,Y. Xing,Eric J. Cotts +6 more
TL;DR: In this article, the effects of alloy composition variations and cooling rates on microstructural stability and deformation processes were investigated in a pure-tin ingot and a reflowed sample.