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J. W. Wan

Researcher at Guangzhou University

Publications -  3
Citations -  134

J. W. Wan is an academic researcher from Guangzhou University. The author has contributed to research in topics: Electronic packaging & Flip chip. The author has an hindex of 3, co-authored 3 publications receiving 124 citations.

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Recent advances in modeling the underfill process in flip-chip packaging

TL;DR: In this article, the models which have been used to describe the properties of underfill flow driven by capillary action are discussed and apply to Newtonian and non-Newtonian behavior with and without the solder bump resistance.
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Influence of transient flow and solder bump resistance on underfill process

TL;DR: A study of flow transient behavior and flow resistance due to the presence of an array of solder bumps in the gap concludes that the assumption of steady flow in the modeling of the flow behavior of fluids in the flip-chip packaging technology is reasonable, and the solder bump resistance to the flow can not be neglected.
Journal ArticleDOI

Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging

TL;DR: The experimental investigation confirmed that the underfill fluid used in flip-chip packaging shows a complex non-Newtonian behavior and that the Washburn model is, indeed, only applicable to the Newtonian fluid in this setting.