Showing papers in "Microelectronics Reliability in 2008"

TL;DR: In this work, the design of flexible and stretchable interconnections is presented by embedding sinuous electroplated metallic wires in a stretchable substrate material that allows a large deformation with the minimum stress concentration.

TL;DR: High temperature aging at 250 °C for up to 196 h has been used to accelerate the aging process of the bonds and the results of micro-XRD analysis confirmed that Cu 9 Al 4 , and CuAl 2 were the main IMC products, while a third phase is found which possibly is CuAl.

TL;DR: The paper discusses when no-fault-found observations should be considered as failures and Guidelines for assessment of intermittent failures are provided.

TL;DR: From this results, it is possible to fabricate high power LED with a small thermal resistance and a good die attach quality by applying Au/Sn eutectic bonding die attach with a high reliability and aGood repeatability.

TL;DR: A broad review the literature for Reliability- and Process-variation aware VLSI design shows a re-emergence of the topic as a core area of active research and is likely to be a part of any reliability qualification protocol for future technology generations.

TL;DR: AlGaN/GaN high electron mobility transistor (HEMT) device operation was modeled from the sub-micrometer scale to the substrate using a combination of an electro-thermal device model for the active device with realistic power dissipation within the device and a coupled three dimensional thermal model to account for the substrate.

TL;DR: In this paper, a variety of new lead-free solders have been developed, which lack the toxicity problems associated with lead-containing solders, but they do not have a long history and manufacturing process and also board level reliability has not been established well.

TL;DR: This type of sensor was found to give fairly appreciable response for lower methane concentrations and for higher methane concentrations, and response is detectable even at 100 °C where the power consumption is only ∼40 mW.

TL;DR: The proposed methodology computes circuit’s signal reliability as a function of its logical masking capabilities, concerning multiple simultaneous faults occurrence, based on signal probability.

TL;DR: This review focuses on the drop-impact reliability of lead-free solder joints that interconnect the integrated circuit (IC) component to the printed circuit board (PCB) and tin-rich lead- free solders exhibit significantly higher strain rate sensitivity than eutectic SnPb solder.

TL;DR: A methodology that combines the vibration failure test, finite element analysis (FEA), and theoretical formulation for the calculation of the electronic component’s fatigue life under vibration loading is developed and it is believed that the methodology is effective in predicting component's life and may be applied further in improving the reliability of electronic systems.

TL;DR: The aim of this note is to point out and correct some errors in the definition of the four arithmetic operations for triangle intuitionistic fuzzy numbers introduced by Shu et al.

TL;DR: The peaked evolution of leakage current with total ionizing dose observed in transistors in 130 nm generation technologies is studied with field oxide field effect transistors (FOXFETs) that use the shallow trench isolation as gate oxide.

TL;DR: The three dimensional electromigration finite element model for IC device/interconnects and solder joint reliability are developed and tested, and a refined mesh sub-model is constructed to reduce the computational costs and to improve the calculation accuracy.

TL;DR: The investigation has been performed on PECVD-SiNx dielectric materials deposited under different deposition conditions and the leakage current was found to obey the Poole–Frenkel law.

TL;DR: A simple method of fluidic microchannel fabrication in low temperature co-fired ceramic (LTCC) substrates based on a new two-step lamination process with using sacrificial volume material (SVM) materials is described.

TL;DR: The ECM rate was increased by decreasing the distance between conductors of the opposite polarity and increasing the bias voltage, and the order of corrosion rate in distilled water with pH 6.5 and NaCl 1.0 wt% solution was electroless Ag, electroplate Sn and ENIG.

TL;DR: Structural and nanomechanical properties of zinc oxide (ZnO) thin films deposited onto Langasite substrates at 200 °C through radio frequency magnetron sputtering with an radio frequency power at200 W in an O2/Ar gas mixture for different deposition time at 1, 2, and 3 h are investigated.

TL;DR: Current research activities and state-of-the-art in this field of systems-in-foil are discussed and a novel technology for embedding conductive circuitry in a polymeric foil is discussed in which a good matching of the elastic moduli of thepolymeric foil and the embedded circuitry is crucial for the flexibility robustness.

TL;DR: The paper describes the attempts to gain deformation data on ultra small solder joints and compares creep data that was experimentally gained on bulky samples and on small solder joint specimens.

TL;DR: The effects of process variations on low-k TDDB degradation will be demonstrated and some key aspects which need to be carefully addressed to control overall low- k TDDB performance from process and integration side will be discussed.

TL;DR: The understanding of the recovery physics can be probed in an unprecedented manner by using this technique, which is able to perform NBTI at a certain stress temperature, which generates a certain degradation level, while the recovery itself can be studied at arbitrary temperatures.

TL;DR: A fatigue reliability model that predicts the drop counts for different drop test conditions was established and numerical solutions of interfacial stresses, obtained by the transient finite element analysis, provided a supporting basis for the crack propagation observed from the experiments.

TL;DR: Atomic force microscopy (AFM) profiling analysis is useful for characterization the IMC growth on the Sn and Cu interface, but there is no direct relation between whisker growth and the RMS value.

TL;DR: The initially extremely low ESD values of FinFETs have been strongly improved by overall process maturity and added process features and are now scalable up to the levels compliant with full IC design constraints.

TL;DR: The main focus of this investigation is on the consequences of raising the maximum operating temperature of IGBT modules and the required design modifications of solder materials at a microstructure level for tackling the drawbacks of state-of-the-art technologies.

TL;DR: Examination of the effect of process-induced voids on the thermal fatigue resistance of CSP solder joints found that voids affect not only the crack initiation but also crack propagation, and estimated numbers of cycles to failure agree quantitatively with the experimental results.

TL;DR: The point-load test associated with the applied force-maximum stress equation, which is proved to be valid for Hertzian contact and, sometimes, required to take into account geometrically nonlinear effect, gives the highest values of strength among these methods.

TL;DR: Results shows that compared with keeping time, storage temperature is a much more important influencing factor on the formation of IMC and soldering joints strength.

TL;DR: This study confirms that the two ageing tests affect differently the ultracapacitor performances, and the impedance real part increase is independent of the frequency in calendar life test while, in power cycling test, this increase is accentuated at low frequencies.