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James G. Fleming

Researcher at Sandia National Laboratories

Publications -  106
Citations -  5011

James G. Fleming is an academic researcher from Sandia National Laboratories. The author has contributed to research in topics: Photonic crystal & Yablonovite. The author has an hindex of 32, co-authored 106 publications receiving 4903 citations. Previous affiliations of James G. Fleming include California Institute of Technology.

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A three-dimensional photonic crystal operating at infrared wavelengths

TL;DR: In this article, the authors constructed a 3D infrared photonic crystal on a silicon wafer using relatively standard microelectronics fabrication technology, which showed a large stop band (10−14.5μm), strong attenuation of light within this band (∼12 dB per unit cell) and a spectral response uniform to better than 1 per cent over the area of the 6-inch wafer.
Journal ArticleDOI

All-metallic three-dimensional photonic crystals with a large infrared bandgap

TL;DR: It is proposed that these 3D metallic photonic crystals can be used to integrate various photonic transport phenomena, allowing applications in thermophotovoltaics and blackbody emission.
Patent

Bistable microelectromechanical actuator

TL;DR: A bistable microelectromechanical actuator as mentioned in this paper is formed on a substrate and includes a stressed membrane of generally rectangular shape that upon release assumes a curvilinear cross-sectional shape due to attachment at a midpoint to a resilient member and at opposing edges to a pair of elongate supports.
Journal ArticleDOI

Three-dimensional photonic crystal with a stop band from 1.35 to 1.95 microm.

TL;DR: A combination of advanced silicon-processing techniques was used to create three-dimensional (3D) photonic crystals with a 180-nm minimum feature size that displayed a strong stop band at optical wavelengths.
Patent

Method for integrating microelectromechanical devices with electronic circuitry

TL;DR: In this article, a method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry on a common substrate is described, where the MEM device can be fabricated within a substrate cavity and encapsulated with a sacrificial material.