We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic RLGC equations derived from the physical configuration. Each analytic equation is proposed as a function of design parameters of the TSV, bump, and RDL, and is therefore, scalable. The scalability of the proposed model is verified by simulation from the 3-D field solver with parameter variations, such as TSV diameter, pitch between TSVs, and TSV height. The proposed model is experimentally validated through measurements up to 20 GHz with fabricated test vehicles of a TSV channel, which includes TSVs, bumps, and RDLs. Based on the proposed scalable model, we analyze the electrical behaviors of a TSV channel with design parameter variations in the frequency domain. According to the frequency-domain analysis, the capacitive effect of a TSV is dominant under 2 GHz. On the other hand, as frequency increases over 2 GHz, the inductive effect from the RDLs becomes significant. The frequency dependent loss of a TSV channel, which is capacitive and resistive, is also analyzed in the time domain by eye-diagram measurements. Due to the frequency dependent loss, the voltage and timing margins decrease as the data rate increases.

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from a TSV. It is important to estimate the TSV noise transfer function and manage the noise-tolerance budget in the design of a reliable 3D-IC system. In this paper, a TSV noise coupling model is proposed based on a three-dimensional transmission line matrix method (3D-TLM). Using the proposed TSV noise coupling model, the noise transfer functions from TSV to TSV and TSV to the active circuit can be precisely estimated in complicated 3D structures, including TSVs, active circuits, and shielding structures such as guard rings. To validate the proposed model, a test vehicle was fabricated using the Hynix via-last TSV process. The proposed model was successfully verified by frequency- and time-domain measurements. Additionally, a noise isolation technique in 3D-IC using a guard ring structure is proposed. The proposed noise isolation technique was also experimentally demonstrated; it provided -17 dB and -10dB of noise isolation between the TSV and an active circuit at 100 MHz and 1 GHz, respectively.

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Through-silicon vias (TSVs) in low, medium and high resistivity silicon for 3-D chip integration and interposers are modeled and thoroughly characterized from 100 MHz to 130 GHz, considering the slow-wave, dielectric quasi-TEM and skin-effect modes. The frequency ranges of these modes and their transitions are predicted using resistivity-frequency domain charts. The impact of the modes on signal integrity is quantified, and three coaxial TSV configurations are proposed to minimize this impact. Finally, conventional expressions for calculating the per-unit-length circuit parameters of transmission lines are extended and used to analytically capture the frequency dependent behavior of TSVs, considering the impact of the mixed dielectric (silicon dioxide-silicon-silicon dioxide) around the TSVs. Excellent correlation is obtained between the analytical calculations using the extended expressions and electromagnetic field simulations up to 130 GHz. These extended expressions can be implemented directly in electronic design automation tools to facilitate performance evaluation of TSVs, prior to system design.

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

This paper presents analytical modeling and 3D full-wave electromagnetic (EM) simulation of the bias voltage dependent semiconductor (MOS) capacitance of a Through Silicon Via (TSV). An accurate electrical model of the TSV is proposed by considering the semiconductor effects. The high-frequency electrical performance of TSVs and Through-Package Vias (TPVs) are compared by means of 3D EM simulations. A parametric study is performed on TSV capacitance and design guidelines are presented for signal and power TSVs.

Electrical modeling of Through Silicon and Package Vias

A semiconductor memory device comprises memory cells, a bitline connected to the memory cells, a read circuit including a precharge circuit, and a first transistor connected between the bitline and the read circuit, wherein a first voltage is applied to a gate of the first transistor when the precharge circuit precharges the bitline, and a second voltage which is different from the first voltage is applied to the gate of the first transistor when the read circuit senses a change in a voltage of the bitline.

Semiconductor memory device.

In this paper, we propose an equivalent circuit model of through wafer via which has height of 90 ?m and diameter of 75 ?m. The equivalent circuit model composed of RLCG components is developed based on the physical configuration of through wafer via. Then, the parameter values of the equivalent circuit model are fitted to the measured s-parameters up to 20GHz by parameter optimization method. The proposed model shows through wafer via is dominantly characterized by the capacitance of thin oxide around the via and resistive characteristic of lossy silicon substrate. From simulated TDR/TDT and eye-diagram waveforms of the proposed equivalent circuit model, it is found that parasitic effects of the via cause slow rising time of a signal during transmission of the signal to the through wafer via. However, unlike to the most cases, the slow rising time of through wafer via will not degrade signal integrity severely. At last, we show the effect of dimension of through wafer via on performance of signal transmission using 3-D full wave simulation.

/pdf/high-frequency-electrical-model-of-through-wafer-via-for-3-d-3hbnjly3pf.pdf

High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging

A duty cycle correction circuit includes a phase splitter configured to control a phase of a DLL clock signal to generate a rising clock signal and a falling clock signal, a clock delay unit configured to delay the rising clock signal and the falling clock signal in response to control signals to generate a delayed rising clock signal and a delayed falling clock signal, a duty ratio correction unit configured to generate a correction rising clock signal and a correction falling clock signal that toggle in response to an edge timing of the delayed rising clock signal and the delayed falling clock signal, and a delay control unit configured to detect duty cycles of the correction rising clock signal and the correction falling clock signal to generate the control signals.

Duty cycle correction circuit and semiconductor integrated circuit apparatus including the same

A duty cycle correction apparatus includes a fixed delay unit configured to set a fixed delay time to a DLL clock signal and generate a delay rising clock signal; a variable delay unit configured to delay the DLL clock signal in response to a control signal and generate a delay falling clock signal; a duty cycle correction unit configured to generate a correction rising clock signal and a correction falling clock signal that are toggled in conformity with edge timing of the delay rising clock signal and the delay falling clock signal; and a delay control unit configured to detect duty cycles of the correction rising clock signal and the correction falling clock signal and generate the control signal.

Duty cycle correction apparatus and semiconductor integrated circuit having the same

A data output circuit includes a control signal generation block configured to generate a first transfer control signal which is produced in a first read operation and a second transfer control signal which is produced in a second read operation, where the first transfer control signal and the second transfer control signal are generated upon entry into a test mode; and an enable signal generation unit configured to generate first and second enable signals for generating first and second internal clocks, in response to the first and second transfer control signals.

Data output circuit

A power noise detecting device includes a plurality of power lines, and a power noise detecting part configured to detect power noise by rectifying voltages of the plurality of power lines and converting the rectified voltages into effective voltages.

Ji Wang Lee

Papers

High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging

Duty cycle correction circuit and semiconductor integrated circuit apparatus including the same

Duty cycle correction apparatus and semiconductor integrated circuit having the same

Data output circuit

Power noise detecting device and power noise control device using the same