Devices, systems, and methods for implanting expandable prostheses in the body lumens rely on stapling or anchoring the prostheses with separately introduced fasteners. The prostheses may be self -expanding or balloon expandable, and may include a single lumen or more than one lumen. After initial placement, a stapling system is introduced within the expanded prosthesis to deploy a plurality of fasteners to at least one prosthesis end. The stapling system may apply a force to the prosthesis to modify the shape of the prosthesis to conform to the shape of the vessel wall. The stapling system can be deflected in one or more distinct steerable segments. A lumen extension or lumens may be coupled to the prosthesis to extend the reach of the prosthesis within the implantation site. Fasteners may also be applied to the lumen extensions.

Devices, systems, and methods for endovascular staple and/or prosthesis delivery and implantation

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Plating catalyst and method

A plurality of functions to configure a unit of a storage volume is maintained, wherein each of the plurality of functions, in response to being applied to the unit of the storage volume, configures the unit of the storage volume differently. Statistics are computed on growth rate of data and access characteristics of the data stored in the unit of the storage volume. A determination is made as to which of the plurality of functions to apply to the unit of the storage volume, based on the computed statistics.

Automated selection of functions to reduce storage capacity based on performance requirements

A catalyst-imparting liquid is provided.  When electroless reductional palladium plating is conducted directly on a copper-based-conductor circuit material, the catalyst-imparting liquid enables an even coating film free from thickness unevenness to be deposited without bridging fine wiring lines.  When the electroless reductional palladium plating is followed by electroless gold plating and then by soldering to the resultant deposit, a coating film having no voids can be formed.  The catalyst-imparting liquid is used for conducting electroless reductional palladium plating on a copper-based metal.  The catalyst-imparting liquid is characterized by containing, as constituent ingredients, a water-soluble gold compound, a heterocyclic compound having a five-membered ring structure including two or more nitrogen atoms, and a chelating agent having an iminodiacetic acid structure.  Also provided are: a process for producing a palladium deposit on a copper-based metal, characterized by using the catalyst-imparting liquid to conduct electroless reductional palladium plating on the copper-based metal; and a palladium deposit produced on a copper-based metal by the process.

Catalyst-imparting liquid for palladium plating

A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.

Film formation method

PROBLEM TO BE SOLVED: To provide a substitution type gold plating liquid with which plating is possible at a practical rate even on an electroless nickel film having a high concentration of phosphorus, and a solder joining applied to the surface of the obtained gold film exhibits sufficient strength even in the case of lead-free type solder. SOLUTION: The electroless gold plating liquid for forming a gold film on an electroless nickel plating film comprises: (a) a water soluble gold compound; (b) a conductive salt composed of an acidic substance having an acid dissociation constant (pKa) of ≤2.2; and (c) an oxidation inhibitor composed of a heterocyclic aromatic compound having two or more nitrogen atoms in the molecule as essential constitutive components. COPYRIGHT: (C)2006,JPO&NCIPI

Substitution type electroless gold plating liquid

A catalyst-imparting liquid which, when used in conducting electroless reductional solder plating directly on a copper-based conductor circuit material, can give an even coating film free from thickness unevenness and enables the formation of a solder deposit having no bridge between fine wiring lines.  Also provided is a solder deposit formed using the catalyst-imparting liquid.  The catalyst-imparting liquid, which is for conducting electroless reductional solder plating on a copper-based metal, is characterized by comprising a water-soluble gold compound and a chelating agent.  The deposit is a solder deposit formed on a copper-based metal, and is characterized by being obtained by using the catalyst-imparting liquid to conduct electroless reductional solder plating.  Furthermore provided is a solder deposit formed over a copper-based metal which has gold in an amount of 3×10 -5 g/cm 2 or smaller on the surface thereof, the deposit having been formed on the gold.

Catalyst-imparting liquid for solder plating

PROBLEM TO BE SOLVED: To provide an electroless gold plating liquid for performing gold plating to a substrate for wire bonding and to provide a method for producing a gold coated film. SOLUTION: The electroless gold plating liquid for precipitating a gold coated film on a palladium plated film contains a water soluble gold compound containing no cyano group, a compound represented by general formula (1) or a salt thereof and an electron donative compound having -30 to -700 mV redox potential. R 1 -S-R 2 -COOR 3 (1) [in general formula (1), R 1 denotes a hydrogen atom, an alkyl group, a hydroxy alkyl group, a carboxyalkyl group, an aryl group to which an alkyl group may be bonded or an aralkyl group; R 2 denotes an alkylene group, an amino alkylene group, an arylene group to which an alkyl group may be bonded or an aralkylene group; and R 3 denotes a hydrogen atom, an alkyl group, an aryl group to which an alkyl group may be bonded or an aralkyl group.]. COPYRIGHT: (C)2011,JPO&INPIT

健児吉羽

Papers

Catalyst-imparting liquid for palladium plating

Substitution type electroless gold plating liquid

Catalyst-imparting liquid for solder plating

Electroless gold plating liquid and gold coated film obtained by using the same

健児 吉羽

Papers

Catalyst-imparting liquid for palladium plating

Substitution type electroless gold plating liquid

Catalyst-imparting liquid for solder plating

Electroless gold plating liquid and gold coated film obtained by using the same

健児吉羽