Patent
Substitution type electroless gold plating liquid
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TLDR
In this paper, a substitution type gold plating liquid with which plating is possible at a practical rate even on an electroless nickel film having a high concentration of phosphorus, and a solder joining applied to the surface of the obtained gold film exhibits sufficient strength even in the case of lead-free type solder.Abstract:
PROBLEM TO BE SOLVED: To provide a substitution type gold plating liquid with which plating is possible at a practical rate even on an electroless nickel film having a high concentration of phosphorus, and a solder joining applied to the surface of the obtained gold film exhibits sufficient strength even in the case of lead-free type solder. SOLUTION: The electroless gold plating liquid for forming a gold film on an electroless nickel plating film comprises: (a) a water soluble gold compound; (b) a conductive salt composed of an acidic substance having an acid dissociation constant (pKa) of ≤2.2; and (c) an oxidation inhibitor composed of a heterocyclic aromatic compound having two or more nitrogen atoms in the molecule as essential constitutive components. COPYRIGHT: (C)2006,JPO&NCIPIread more
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