Devices, systems, and methods for implanting expandable prostheses in the body lumens rely on stapling or anchoring the prostheses with separately introduced fasteners. The prostheses may be self -expanding or balloon expandable, and may include a single lumen or more than one lumen. After initial placement, a stapling system is introduced within the expanded prosthesis to deploy a plurality of fasteners to at least one prosthesis end. The stapling system may apply a force to the prosthesis to modify the shape of the prosthesis to conform to the shape of the vessel wall. The stapling system can be deflected in one or more distinct steerable segments. A lumen extension or lumens may be coupled to the prosthesis to extend the reach of the prosthesis within the implantation site. Fasteners may also be applied to the lumen extensions.

Devices, systems, and methods for endovascular staple and/or prosthesis delivery and implantation

Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers and having a layer structure. The via includes a first via layer formed through the first insulating layer, a second via layer formed on the first via layer while passing through the second insulating layer, and an adhesive layer between the first and second via layers. The first via layer has a section different from a section of the second via layer.

The printed circuit board and the method for manufacturing the same

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Plating catalyst and method

A plurality of functions to configure a unit of a storage volume is maintained, wherein each of the plurality of functions, in response to being applied to the unit of the storage volume, configures the unit of the storage volume differently. Statistics are computed on growth rate of data and access characteristics of the data stored in the unit of the storage volume. A determination is made as to which of the plurality of functions to apply to the unit of the storage volume, based on the computed statistics.

Automated selection of functions to reduce storage capacity based on performance requirements

PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPIT

Electroless gold-plating method and electronic component

PROBLEM TO BE SOLVED: To provide an electrolytic gold plating solution that can afford higher deposition efficiency than the conventional gold plating solution without causing poor appearance of a gold plated film while favorably retaining mechanical characteristics, wear resistance, electrical characteristics and the like and can reduce the production cost by shortening the time required for gold plating deposition and reducing the concentration of expensive gold contained in the gold plating solutionSOLUTION: The electrolytic gold plating solution contains: a gold cyanide salt as a gold source; and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one kind or two or more kinds of specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, an alkoxysulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group A gold film is produced by performing electrolytic gold plating on a nickel film using the electrolytic gold plating solution

Electrolytic gold plating solution and gold film obtained using the same

A catalyst-imparting liquid is provided.  When electroless reductional palladium plating is conducted directly on a copper-based-conductor circuit material, the catalyst-imparting liquid enables an even coating film free from thickness unevenness to be deposited without bridging fine wiring lines.  When the electroless reductional palladium plating is followed by electroless gold plating and then by soldering to the resultant deposit, a coating film having no voids can be formed.  The catalyst-imparting liquid is used for conducting electroless reductional palladium plating on a copper-based metal.  The catalyst-imparting liquid is characterized by containing, as constituent ingredients, a water-soluble gold compound, a heterocyclic compound having a five-membered ring structure including two or more nitrogen atoms, and a chelating agent having an iminodiacetic acid structure.  Also provided are: a process for producing a palladium deposit on a copper-based metal, characterized by using the catalyst-imparting liquid to conduct electroless reductional palladium plating on the copper-based metal; and a palladium deposit produced on a copper-based metal by the process.

Catalyst-imparting liquid for palladium plating

PROBLEM TO BE SOLVED: To provide a substitution type gold plating liquid with which plating is possible at a practical rate even on an electroless nickel film having a high concentration of phosphorus, and a solder joining applied to the surface of the obtained gold film exhibits sufficient strength even in the case of lead-free type solder. SOLUTION: The electroless gold plating liquid for forming a gold film on an electroless nickel plating film comprises: (a) a water soluble gold compound; (b) a conductive salt composed of an acidic substance having an acid dissociation constant (pKa) of ≤2.2; and (c) an oxidation inhibitor composed of a heterocyclic aromatic compound having two or more nitrogen atoms in the molecule as essential constitutive components. COPYRIGHT: (C)2006,JPO&NCIPI

Substitution type electroless gold plating liquid

PROBLEM TO BE SOLVED: To provide an electroless gold plating liquid or electrolytic gold plating liquid having excellent plating running stability, and to provide a gold sulfite salt aqueous solution for gold plating liquid to obtain gold plating liquid having excellent plating running stability. SOLUTION: Gold sulfite salt aqueous solution for gold plating liquid containing gold sulfite salt and sulfite salt with the particle increment ratio being ≤20% is used for a gold source of electroless gold plating liquid or electrolytic gold plating liquid. By supplying gold sulfite salt aqueous solution, the plating liquid can be used for a long time. Stability of the plating liquid is an important factor for reducing the cost, in particular, in a case of the noble metal plating. COPYRIGHT: (C)2006,JPO&NCIPI

Gold sulfite salt aqueous solution for gold plating

Provided is a reduction-type electroless tin plating solution suitable for practical use, which rarely causes replacement reaction on a substrate consisting of either copper or a copper alloy, which enables high-speed stable deposition, which is stable and attains high productivity, and which causes neither breaking of a conductor nor outgrowth of tin even when the conductor has a fine form. The reduction-type electroless tin plating solution is characterized by comprising, as the essential constituents, a water-soluble tin compound, a water-soluble titanium compound, an organic complexing agent, and an organosulfur compound selected from the group consisting of mercaptans and sulfides.

茂樹清水

Papers

Electrolytic gold plating solution and gold film obtained using the same

Catalyst-imparting liquid for palladium plating

Substitution type electroless gold plating liquid

Gold sulfite salt aqueous solution for gold plating

Reduction-type electroless tin plating solution and tin coats formed by using the same

茂樹 清水

Papers

Electrolytic gold plating solution and gold film obtained using the same

Catalyst-imparting liquid for palladium plating

Substitution type electroless gold plating liquid

Gold sulfite salt aqueous solution for gold plating

Reduction-type electroless tin plating solution and tin coats formed by using the same

茂樹清水