Enhanced bacteriostatic activity, osteogenesis and osseointegration of silicon nitride/polyetherketoneketone composites with femtosecond laser induced micro/nano structural surface

The purpose of this review article is to summarize previous research works done on polymer composites filled with various types of nitride compounds for potential applications, specially for electronic and thermal management applications. It includes the general structure and introduction to nitride compounds, the assessment of nitride compounds filled polymer composites, and their relevant applications. The current industry's heat and electrical equipment requirements are lightweight, low cost, compactness, mechanical properties as well as superior thermal and electrical properties. The aluminum and copper-based materials show an excellent properties, but they are expensive and heavy. Hence, polymers are preferred in place of metals due to their recyclability, low cost, and sufficient mechanical, thermal, and electrical properties suitable for various applications. Further addition of nitride compounds such as boron nitride (BN), silicon nitride (Si 3 N 4 ), carbon nitride (C 3 N 4 ), aluminum nitride (AlN), and titanium nitride (TiN) to these polymers boost the overall mechanical, thermal, and electrical properties of the resultant composites. These conductive nitride compounds addition gives a major contribution to the thermal conductivity and dielectric properties enhancement in the polymer composites. In this review article, an attempt is made to summarize and explore brief results and key points of previous research works done on the nitride compounds loaded polymer composites. This review will be beneficial and motivate the current, upcoming researchers to conduct innovative works related to nitride compounds filled polymer composites to increase the applicability in various sectors. 

Review on nitride compounds and its polymer composites: a multifunctional material

High strength polymer/silicon nitride composites for dental restorations.

Fabrication of enamel-like structure on polymer-infiltrated zirconia ceramics

Thermal management remains an important consideration for many applications such as automobile pistons, dies in furnaces and heat sinks in electronics, where high thermal conductivity and low coefficient of thermal expansion are desired. In this paper, we report an improved microhardness value and negative coefficient of thermal expansion (CTE) for Gr–Al composites by incorporating silicon nitride (Si3N4) and silicon carbide (SiC) into Gr–Al matrix. Si3N4 and SiC particles (average size of 72 nm) were obtained after 30 and 50 h of ball-milling, respectively. Gr–Al composite were reinforced with Si3N4 and SiC particles (4, 8, 12 and 16 wt% each), and then sintered at a temperature of 560 °C, pressure of 50 MPa, heating rate of 50 °C/min and dwelling time of 10 min using spark plasma sintering system. The sintered samples were characterized for morphology, microhardness, relative density, coefficient of thermal expansion and wear resistance. Addition of 16 wt% Si3N4 reduced relative density from 99.9 to 89.47% indicating lower densification. CTE decreased with increased Si3N4 fraction reaching minimum value of 12.37 × 10–6 °C (which is 42.5% reduction) for Gr–Al + 12 wt% Si3N4. However, Gr–Al + 8 wt% SiC + 8 wt% Si3N4 composite has the minimum negative CTE (− 21 × 10–6 °C), maximum displacement (2.48 mm), maximum displacement rate (1.12 mm/s) and minimum hardness value (26.8 GPa). While the hardness was marginally increased with Si3N4, addition of 12 wt% SiC + 12 wt% Si3N4 raised the hardness by 37%. Also, the wear area increased with applied force. These results indicate that Gr–Al + 8 wt% SiC + 8 wt% Si3N4 composite is suitable for applications requiring combination of low (negative) thermal expansion, high microhardness value and maximum densification. Effectively, the synergic effect of combined SiC and Si3N4 particles has been brought to the fore.

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Jian Sun

Papers

High strength polymer/silicon nitride composites for dental restorations.

Study on antibacterial and fluoride-releasing properties of a novel composite resin with fluorine-doped nano-zirconia fillers.

Effects of pore connectivity and microstructure on mechanical performance of ZrO2 scaffolds and PMMA-infiltrated ZrO2 composites