J
Jinwoo Choi
Researcher at IBM
Publications - 44
Citations - 672
Jinwoo Choi is an academic researcher from IBM. The author has contributed to research in topics: Signal & Electrical impedance. The author has an hindex of 14, co-authored 44 publications receiving 666 citations. Previous affiliations of Jinwoo Choi include Georgia Institute of Technology & Georgia Tech Research Institute.
Papers
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Proceedings ArticleDOI
A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications
TL;DR: In this article, an alternating impedance EBG (AI-EBG) was proposed for isolation in mixed-signal systems, which suppressed almost all possible electromagnetic modes in stopband frequencies.
Journal ArticleDOI
Modeling and analysis of power distribution networks for Gigabit applications
Jinwoo Choi,Sung-Hwan Min,Joong-Ho Kim,Madhavan Swaminathan,Wendemagegnehu T. Beyene,Xingchao Yuan +5 more
TL;DR: This paper presents the modeling, simulation, and characterization of the PDN in a high-speed printed circuit board (PCB) designed for chip-to-chip communication at a data rate of 3.2 Gbps.
Patent
Mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structures for noise suppression/isolation
TL;DR: In this paper, the Alternating impedance electromagnetic bandgap (AI-EBG) structures and methods of constructing them are described and discussed. But they do not discuss the design of the structures.
Journal ArticleDOI
Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)
TL;DR: In this paper, the authors proposed an alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN) for noise isolation and suppression in mixed-signal systems.
Patent
Electromagnetic bandgap structure for isolation in mixed-signal systems
TL;DR: In this article, the authors describe an EBG structure with a plurality of first elements disposed on a first plane of a device; and a second element connecting each first element to an adjacent first element, the second element being disposed on the first planes of the device.