J
Joseph A. Benenati
Researcher at IBM
Publications - 7
Citations - 489
Joseph A. Benenati is an academic researcher from IBM. The author has contributed to research in topics: Temperature cycling & Chip carrier. The author has an hindex of 6, co-authored 7 publications receiving 489 citations.
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Patent
Thermal enhancement approach using solder compositions in the liquid state
TL;DR: In this paper, a solder composition has been introduced to interface between an IC chip and its associated heat exchanger cover, which has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline resulting from temperature fluctuations associated with the thermal cycles of the integrated circuit chips.
Patent
Rolling ball connector
Joseph A. Benenati,Claude L. Bertin,William T. Chen,Thomas Edward Dinan,Wayne F. Ellis,Wayne J. Howell,John U. Knickerbocker,Mark V. Pierson,William R. Tonti,Jerzy M. Zalesinski +9 more
TL;DR: In this paper, a pliable material is used to bond metal balls in movable contact with the pads of the chip and the substrate to avoid thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art.
Patent
Solder ball interconnected assembly
John Acocella,Donald Ray Banks,Joseph A. Benenati,Thomas Caulfield,Karl Grant Hoebener,David P. Watson,John S. Corbin +6 more
TL;DR: In this paper, high melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a chip carrier substrate by low melting temperature eutectic pb/sn solder.
Patent
Zero force heat sink
Eugene R. Atwood,Joseph A. Benenati,James J. Dankelman,Horatio Quinones,Karl J. Puttlitz,Eric J. Kastberg +5 more
TL;DR: In this paper, the heat sink is attached coaxially through an aperture to the substrate, and then the substrate is relaxed such that the substrate and is completely supported by the frame and the heat sinks imparts zero or nearly zero downward force.
Patent
Solder ball connections and assembly process
John Acocella,Donald Ray Banks,Joseph A. Benenati,Thomas Caulfield,John S. Corbin,Karl Grant Hoebener,David P. Watson +6 more
TL;DR: In this paper, high melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a chip carrier substrate by low melting temperature eutectic pb/sn solder.