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K. D. M. Rao

Researcher at Indian Association for the Cultivation of Science

Publications -  29
Citations -  1070

K. D. M. Rao is an academic researcher from Indian Association for the Cultivation of Science. The author has contributed to research in topics: Electrode & Layer (electronics). The author has an hindex of 15, co-authored 29 publications receiving 865 citations. Previous affiliations of K. D. M. Rao include Jawaharlal Nehru Centre for Advanced Scientific Research & Indian National Association.

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Visibly Transparent Heaters.

TL;DR: This review provides topical coverage of next generation transparent conducting electrodes (TCE) based on a wide range of materials such as oxide nanoparticles, CNTs, graphene, metal nanowires, metal meshes and their hybrids.
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Spray coating of crack templates for the fabrication of transparent conductors and heaters on flat and curved surfaces.

TL;DR: Spray coating in the context of crack template is a powerful method for producing transparent heaters, which is shown for the first time in this work.
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A highly crystalline single Au wire network as a high temperature transparent heater

TL;DR: A wire network made of Au on quartz is shown to serve as an effective high temperature transparent heater that gets self-annealed through joule heating as seen from its increased crystallinity.
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Fabrication of Large Area, High‐Performance, Transparent Conducting Electrodes Using a Spontaneously Formed Crackle Network as Template

TL;DR: In this article, a single micro/nanowire network of a metal deposited over a large area on a transparent substrate serves as a transparent conducting electrode with optoelectronic properties that are enhanced in many ways relative to the conventional indium tin oxide films.
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Large area solution processed transparent conducting electrode based on highly interconnected Cu wire network

TL;DR: In this article, the authors used a four-step process involving deposition of commercially available colloidal dispersions onto polyethylene terephthalate (PET), drying to induce crackle network formation, nucleating Au or Pd seed nanoparticles inside the crackle regions, washing away the sacrificial layer and finally, depositing Cu electrolessly or by electroplating.