A method and system for vapor deposition on a substrate that disposes a substrate in a process space of a processing system that is isolated from a transfer space of the processing system, processes the substrate at either of a first position or a second position in the process space while maintaining isolation from the transfer space, and deposits a material on said substrate at either the first position or the second position. Furthermore, the system includes a high conductance exhaust apparatus configured to be coupled to the process space, whereby particle contamination of the substrate processed in the deposition system is minimized. The exhaust apparatus comprises a pumping system located above the substrate and an evacuation duct, wherein the evacuation duct has an inlet located below the substrate plane.

Exhaust apparatus configured to reduce particle contamination in a deposition system

Provided is a substrate processing apparatus in which after a module is disabled, a substrate is provided to a carry-in module capable of placing the wafers most rapidly in the plurality of unit blocks and the substrates are sequentially transported to the module group by the transportation means to be delivered to the carry-out module according to a providing sequence of the substrate to the carry-in module in each of the plurality of unit blocks. In particular, the substrates are extracted from the carry-out module according to a providing sequence of the substrate to the carry-in module and transported to a rear module or a substrate placing part. Thereafter, the substrates are transported to the rear module from the carry-out module or the substrate placing part according to a predetermined sequence in which the substrate is provided to the carry-in module in a normal state.

Substrate processing apparatus and substrate processing method

In a state where a wafer is held by a wafer holding section and a temperature controlled liquid is discharged to a rim area on a rear face of the wafer from flow channels, a developing solution is heaped on a front face of the wafer. Thereafter, the wafer is rotated for a predetermined period of time in a state where the temperature controlled liquid is discharged to the rim area on the rear face of the wafer from the flow channels, whereby developing is performed. The wafer is heated by the wafer holding section with a large heat capacity in an area close to a center of the wafer, and a liquid film of the temperature controlled liquid is formed in the rim area of the wafer, whereby the wafer is heated. At this time, the wafer is rotated, so that the developing solution is stirred.

Substrate processing apparatus and method

A current member is disposed above a wafer holding section for holding a wafer and a top plate and a bottom plate of the current member are positioned so that respective air holes are overlapped each other in a vertical direction, and a developing solution is heaped on a front face of the wafer. Thereafter, the developing is performed with the bottom plate of the current member slid in a lateral direction so that the air holes are not overlapped each other in the vertical direction. In this configuration, air streams to the wafer are obstructed during the developing because the air holes in the current member are obstructed in the vertical direction, whereby occurrence of temperature distribution of the developing solution within the plane of the wafer caused by flows of air currents to the wafer is prevented and uniform developing processing can be performed.

Developing apparatus and method thereof

A plurality of photomasks used to manufacture the same semiconductor device, each of the photomasks having a plurality of mutually replaceable unit regions set therein, are inspected to detect a defect. It is determined whether or not the detected defect has a redundancy defect positioned in a unit region replaceable with another unit region to remedy the photomask. Then, when inspecting the second or subsequent photomask, a unit region including the coordinate of a redundancy defect detected in another photomask inspected previously is set to be a non-inspection region, and the non-inspection region is not inspected.

Photomask inspection method, semiconductor device inspection method, and pattern inspection apparatus

PROBLEM TO BE SOLVED: To make an inspection of presence/absence of a defect in an imprint pattern efficient.SOLUTION: A conductive layer 2 is formed on an under layer 1. An imprint pattern 4 is formed on the conductive layer 2. An electrolytic solution 6 is brought into contact with the imprint pattern 4, and an electrode 7 is brought into contact with the electrolytic solution 6. A voltage is applied between the conductive layer 2 and an electrode 6, and a current flowing between the conductive layer 2 and the electrode 7 is measured. The presence/absence of the defect of the imprint pattern 4 is determined based on the result of the measurement of the current.

Defect inspection method and manufacturing method of semiconductor device

PROBLEM TO BE SOLVED: To reduce impacts on a template and a resist pattern as much as possible during mold release.SOLUTION: An imprinting method, which applies a first curable resin material to a substrate to be processed and transfers a semiconductor integrated circuit pattern created in the template onto the substrate to be processed applied with the first curable resin material, is characterized by comprising a step of applying a second curable resin material having releasability higher than that of the first curable resin material, to at least a part of the outer periphery of a region in which a pattern is to be formed by one-time transfer.

Imprinting method and imprinting apparatus

PROBLEM TO BE SOLVED: To provide a photomask forming device in which a pattern indicating the applicable region and the non-applicable region of a redundant circuit is formed on a photomask and whether the redundant circuit is applicable or not to a defect position caused on the photomask can be decided during photomask inspection, and a photomask inspection device. SOLUTION: A photomask is formed by combining a mask pattern and a SRAF (sub-resolution assist feature) pattern indicating the applicable region/non-applicable region of a redundant circuit in the mask forming device 100, which enables a mask inspection process to decide whether the redundant circuit is applicable or not, the decision conventionally carried out by a person. Therefore, a human error on the decision can be eliminated and productivity of a photomask process can be improved. COPYRIGHT: (C)2008,JPO&INPIT

Photomask forming device and photomask inspection device

PURPOSE: To provide a developing device and a developing method capable of developing a high precision pattern by preventing heat of vaporization of a developing solution from being produced and further preventing substrate temperature from being changed when a substrate is transferred. CONSTITUTION: A semiconductor substrate 14 on which a resist film to be developed is formed is held between an upper thermostatic plate 10 and a lower thermostatic plate 11, in both of which plates electric heater wires 12 are buried, and is made the same in temperature. Then, the substrate 14 is transferred to a developing tank with use of a transfer arm 13 together with the upper thermostatic plate 10 having a windshield plate 17 to prevent temperature of the substrate 14 from being changed during the transfer. Further, the developing tank is covered with the upper thermostatic plate 10 during the development to close the developing solution, whereby heat of vaporization of the developing solution is prevented from being produced. COPYRIGHT: (C)1994,JPO&Japio

Method and device for semiconductor substrate

PROBLEM TO BE SOLVED: To easily prepare a drop recipe.SOLUTION: This method includes a test drop recipe preparation step for preparing a plurality of testing drop recipes based on design data of a semiconductor integrated circuit, a selection step for selecting the drop recipe with a smallest number of defects for every imprinting position on a processed substrate from the plural testing drop recipes based on results of defect tests of patterns of a hardening resin material formed by imprinting a template, on which a pattern of the semiconductor integrated circuit is formed, on the hardening resin material applied to a processed substrate using the testing drop recipe, and a database step for creating a drop recipe preparation assist database by collecting the drop recipe for every selected imprinting position in every functional circuit block constituting the semiconductor integrated circuit.

康男松岡

Papers

Defect inspection method and manufacturing method of semiconductor device

Imprinting method and imprinting apparatus

Photomask forming device and photomask inspection device

Method and device for semiconductor substrate

Drop recipe preparation method and database generating method

康男 松岡

Papers

Defect inspection method and manufacturing method of semiconductor device

Imprinting method and imprinting apparatus

Photomask forming device and photomask inspection device

Method and device for semiconductor substrate

Drop recipe preparation method and database generating method

康男松岡