Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

Flexible heat sink

A thermal management system (10) provides a heat dissipating component using a high thermal conductivity insert (22). The heat dissipating component may be a spreader (12) or heat sink, and includes a planar graphite member (16) having high thermal conductivity along the plane of the member (X, Y) and having a relatively low thermal conductivity through the thickness of the member (Z). A cavity (20) is formed through the thickness of the member and the high conductivity insert (22) is received in the cavity (20). The insert (22) may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element (Z).

Heat dissipating component using high conducting inserts

Process for producing formed Ta/Nb powder metallurgy products using Ta and/or Nb hydride powders with an oxygen content greater than a target level, e.g., 300 ppm, heating the metal hydride in the presence of another metal having a higher affinity for oxygen, removing the other metal and any reaction byproducts, to form a metal powder with an oxygen content less than the target level and forming a metallurgical product from said oxygen reduced Ta/Nb powder with an oxygen content less than the target level.

Low oxygen refractory metal powder for powder metallurgy

This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m° K and it is capable of being molded using high speed molding techniques such as injection molding.

Thermally conductive thermoplastic

A fast quench reaction includes a reactor chamber having a high temperature heating means such as a plasma torch at its inlet and a restrictive convergent-divergent nozzle at its outlet end. Reactants are injected into the reactor chamber. The resulting heated gaseous stream is then rapidly cooled by passage through the nozzle. This "freezes" the desired end product(s) in the heated equilibrium reaction stage.

Fast quench reactor and method

A thermal conductivity sheet is provided which is superior all in heat radiating characteristics (thermal conductivity) in the direction of sheet thickness, close-contact with respect to parts to be cooled, and electrical insulation. In a thermal conductivity sheet 1 in which a plurality of highly thermally conductive insulators 3 are dispersed in a matrix insulator 2, the highly thermally conductive insulators 3 are oriented obliquely or erectly in the direction of thickness of the thermal conductivity sheet 1 such that at least one end faces of the highly thermally conductive insulators 3 are exposed to a surface of the matrix insulator 2. Preferably, a ratio of the total sectional area of the highly thermally conductive insulators 3 to the total surface area of the thermal conductivity sheet 1 is set to be equal to or larger than 1%.

Thermal conductivity sheet

Disclosed is a highly pure titanium which comprises containing not more than 200 ppm of oxygen; not more than 30 ppm each of elements consisting of iron, nickel and chromium, and not more than 0.1 ppm each of elements consisting of sodium and potassium. Disclosed is also a process for preparing the above highly pure titanium which comprises melting a crude titanium obtained by molten salt electrolysis, in a high vacuum of 5 x 10⁻⁵ mbar or less.

Highly pure titanium and process for producing the same

A heat dissipating sheet excelling in heat dissipating characteristic (thermal conductivity) in the thickness direction, adhesion to the part to be cooled, and electrical insulating quality. In a heat dissipating sheet (1) wherein a plurality of insulators (3) having high thermal conductivities are dispersed in a matrix-like insulator (2), each insulator (3) is oriented upright or inclinedly with respect to the thickness direction of the heat dissipating sheet (1) so that at least one edge of each insulator is exposed from the surface of the matrix-like insulator (2). Also, the ratio of the sum of all the cross-sectional areas of the insulators (3) to the area of the surface of the heat dissipating sheet (1) is preferably more than 1 %.

Heat dissipating sheet

Disclosed is a highly pure titanium which comprises containing not more than 200 ppm of oxygen; not more than 30 ppm each of elements consisting of iron, nickel and chromium, and not more than 0.1 ppm each of elements consisting of sodium and potassium. Disclosed is also a process for preparing the above highly pure titanium which comprises melting a crude titanium obtained by molten salt electrolysis, in a high vacuum of 5×10-5 mbar or less.

Highly pure titanium

PURPOSE:To reduce the thermal contact resistance between a heat generating body and cooling parts by dispersing the powder of sintered aluminum nitride in the matrix of a flexible insulating material. CONSTITUTION:A module structure body 1a is constituted by mounting and sticking a TEG chip 3 for measuring thermal resistance of 10W in power consumption on and to the upper surface of a ceramic substrate 2 made of aluminum nitride as a semiconductor element 3. A heat radiating fin 4 is put on the upper surface of the chip 3 with a sheet-like heat radiating body 11 which has high thermal conductivity and in the resin matrix of which the powder of sintered aluminum nitride is dispersed and grease-like heat radiating body 12 having high thermal conductivity in between. Therefore, the thermal contact resistance between a heat generating body and cooling parts can be remarkably reduced when the heat radiating bodies 11 and 12 are interposed between them, because the bodies 11 and 12 have high coefficients of thermal conductivity, plasticity, and flexibility and the degree of contact between the bodies 11 and 12 is improved.

Kazumi Shimotori

Papers

Thermal conductivity sheet

Highly pure titanium and process for producing the same

Heat dissipating sheet

Highly pure titanium

Heat radiating body having high thermal conductivity and its manufacture