Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

Flexible heat sink

A thermal management system (10) provides a heat dissipating component using a high thermal conductivity insert (22). The heat dissipating component may be a spreader (12) or heat sink, and includes a planar graphite member (16) having high thermal conductivity along the plane of the member (X, Y) and having a relatively low thermal conductivity through the thickness of the member (Z). A cavity (20) is formed through the thickness of the member and the high conductivity insert (22) is received in the cavity (20). The insert (22) may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element (Z).

Heat dissipating component using high conducting inserts

This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m° K and it is capable of being molded using high speed molding techniques such as injection molding.

Thermally conductive thermoplastic

The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.

Structure of image sensor module and a method for manufacturing of wafer level package

A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

A thermal conductivity sheet is provided which is superior all in heat radiating characteristics (thermal conductivity) in the direction of sheet thickness, close-contact with respect to parts to be cooled, and electrical insulation. In a thermal conductivity sheet 1 in which a plurality of highly thermally conductive insulators 3 are dispersed in a matrix insulator 2, the highly thermally conductive insulators 3 are oriented obliquely or erectly in the direction of thickness of the thermal conductivity sheet 1 such that at least one end faces of the highly thermally conductive insulators 3 are exposed to a surface of the matrix insulator 2. Preferably, a ratio of the total sectional area of the highly thermally conductive insulators 3 to the total surface area of the thermal conductivity sheet 1 is set to be equal to or larger than 1%.

Thermal conductivity sheet

A heat dissipating sheet excelling in heat dissipating characteristic (thermal conductivity) in the thickness direction, adhesion to the part to be cooled, and electrical insulating quality. In a heat dissipating sheet (1) wherein a plurality of insulators (3) having high thermal conductivities are dispersed in a matrix-like insulator (2), each insulator (3) is oriented upright or inclinedly with respect to the thickness direction of the heat dissipating sheet (1) so that at least one edge of each insulator is exposed from the surface of the matrix-like insulator (2). Also, the ratio of the sum of all the cross-sectional areas of the insulators (3) to the area of the surface of the heat dissipating sheet (1) is preferably more than 1 %.

Heat dissipating sheet

PURPOSE:To efficiently disperse heat generated, and concurrently enable a device to be made small in size while the rotating efficiency of a rotor is being enhanced by letting insulating heat radiating material be composed of solid insulating material in which high heat conductive fillers are dispersed in base material composed of resin. CONSTITUTION:The device is equipped with insulating heat radiating material 17 which is molded in each gap between a device main body and each component. And the heat radiating material 17 is composed of solid insulating material 18 in which aluminum nitride sintered powder is dispersed as a high heat conductive filler into base material composed of epoxyresin. And a support insulating pipe 8a is also formed out of the insulating material 18. Since the insulating material 18 whose insulating proof strength and heat conductivity are equal to or more than those each of which is four timed as large as that of insulating oil, is used as the heat radiating material 17, each insulating distance among component parts such as a X-ray tube 3, a field coil 10 and the like can be made small, moreover, its cooling characteristics can also be improved. Therefore, the device can be made small in size and light in weight.

Toshiya Sakamoto

Papers

Thermal conductivity sheet

Heat dissipating sheet

Insulating heat radiating material for x-ray tube device