Kevin R. Bagnall

TL;DR: The design, fabricated, and experimentally characterized a microfluidic device for ultra-high heat flux dissipation using evaporation from a nanoporous silicon membrane, suggesting that evaporative membrane-based approaches can be promising towards realizing an efficient, high flux thermal management strategy over large areas for high-performance electronics.

TL;DR: In this article, a closed-form analytical solution for the temperature distribution in a rectangular structure with rectangular isoflux heat sources, any number of layers of arbitrary thermal conductivity, and perfect interfacial contact or finite interfacial conductance was presented.

TL;DR: In this paper, a new and more general solution for thermal spreading resistance in compound, orthotropic systems with interfacial resistance is considered, which extends beyond previously published results and is obtained for a finite rectangular heat source of uniform strength arbitrarily located on a rectangular substrate.

TL;DR: In this paper, a high heat-flux cooling device for advanced thermal management of electronics is presented, which incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation.

TL;DR: Wang et al. as mentioned in this paper designed, fabricated, and experimentally characterized a microfluidic device for ultra-high heat flux dissipation using evaporation from a nanoporous silicon membrane.