Nano and micro electro-mechanical systems (NEMS and MEMS) have been attracting a large amount of attention recently as they have extensive current/potential applications. However, due to their scale, molecular interaction and size effects are considerably high which needs to be considered in the theoretical modelling of their electro-mechanical behaviour. Both nano- and micro-scale electrically actuated structures are discussed when subjected to constant and time-varying voltages, and different theories and models, introduced in the past few years for modelling such small structures, are discussed. It is highlighted that considering the intermolecular forces and size-dependence effects can change both the static and dynamic behaviours of such systems significantly. This review presents the current stage of the research on electrically actuated NEMS/MEMS by analysing the latest models and studies in this field in the framework of electro-mechanical coupling and small-size effects.

A review on the statics and dynamics of electrically actuated nano and micro structures

Dynamic axial focusing functionality has recently experienced widespread incorporation in microscopy, augmented/virtual reality (AR/VR), adaptive optics and material processing. However, the limitations of existing varifocal tools continue to beset the performance capabilities and operating overhead of the optical systems that mobilize such functionality. The varifocal tools that are the least burdensome to operate (e.g. liquid crystal, elastomeric or optofluidic lenses) suffer from low (≈100 Hz) refresh rates. Conversely, the fastest devices sacrifice either critical capabilities such as their dwelling capacity (e.g. acoustic gradient lenses or monolithic micromechanical mirrors) or low operating overhead (e.g. deformable mirrors). Here, we present a general-purpose random-access axial focusing device that bridges these previously conflicting features of high speed, dwelling capacity and lightweight drive by employing low-rigidity micromirrors that exploit the robustness of defocusing phase profiles. Geometrically, the device consists of an 8.2 mm diameter array of piston-motion and 48-μm-pitch micromirror pixels that provide 2π phase shifting for wavelengths shorter than 1100 nm with 10-90% settling in 64.8 μs (i.e., 15.44 kHz refresh rate). The pixels are electrically partitioned into 32 rings for a driving scheme that enables phase-wrapped operation with circular symmetry and requires <30 V per channel. Optical experiments demonstrated the array's wide focusing range with a measured ability to target 29 distinct resolvable depth planes. Overall, the features of the proposed array offer the potential for compact, straightforward methods of tackling bottlenecked applications, including high-throughput single-cell targeting in neurobiology and the delivery of dense 3D visual information in AR/VR.

/pdf/a-micromirror-array-with-annular-partitioning-for-high-speed-3go38oayqq.pdf

A micromirror array with annular partitioning for high-speed random-access axial focusing.

Dynamic axial focusing functionality has recently experienced widespread incorporation in microscopy, augmented/virtual reality (AR/VR), adaptive optics, and material processing. However, the limitations of existing varifocal tools continue to beset the performance capabilities and operating overhead of the optical systems that mobilize such functionality. The varifocal tools that are the least burdensome to drive (ex: liquid crystal, elastomeric or optofluidic lenses) suffer from low (~ 100 Hz) refresh rates. Conversely, the fastest devices sacrifice either critical capabilities such as their dwelling capacity (ex: acoustic gradient lenses or monolithic micromechanical mirrors) or low operating overhead (e.g., deformable mirrors). Here, we present a general-purpose random-access axial focusing device that bridges these previously conflicting features of high speed, dwelling capacity and lightweight drive by employing low-rigidity micromirrors that exploit the robustness of defocusing phase profiles. Geometrically, the device consists of an 8.2 mm diameter array of piston-motion and 48 um-pitch micromirror pixels that provide 2pi phase shifting for wavelengths shorter than 1 100 nm with 10-90 % settling in 64.8 us (i.e., 15.44 kHz refresh rate). The pixels are electrically partitioned into 32 rings for a driving scheme that enables phase-wrapped operation with circular symmetry and requires less than 30 V per channel. Optical experiments demonstrated the array's wide focusing range with a measured ability to target 29 distinct, resolvable depth planes. Overall, the features of the proposed array offer the potential for compact, straightforward methods of tackling bottlenecked applications including high-throughput single-cell targeting in neurobiology and the delivery of dense 3D visual information in AR/VR.

/pdf/a-micromirror-array-with-annular-partitioning-for-high-speed-3tgamj1s8p.pdf

A micromirror array with annular partitioning for high-speed random-access axial focusing

In this paper, a novel RF MEMS shunt capacitive switch with application in the Ka frequency band is proposed. The spring design and the step structure added to the beam succeeded in improving the performance of the switch and reducing the stress which results in extended life-time of the switch. Also, by optimally reducing the gap between the dielectric and the beam (without problems such as self-actuation), the actuation voltage of the switch is significantly reduced. Electromechanical and scattering parameters analysis have been done by using COMSOL Multiphysics and HFSS software, respectively. The actuation voltage of the proposed device is 9.2 V. Since the aluminum has a lower mass compared to gold, an aluminum beam has been used in the switch. Desirable scattering parameters at the resonance frequency of 33.5 GHz have been obtained which include insertion loss of − 0.3 dB and return loss of − 18 dB. The high isolation of − 57 dB verifies the improved performance of the switch. Finally, as another innovation in this paper, the effect of inductor and capacitor presence in the input of transmission line is investigated. This analysis has been done by using ADS. Results of the circuit analysis presented in this paper, help the MEMS switch designers to understand the realistic switch behavior before fabrication which considerably saves cost and time.

Development of a low stress RF MEMS double-cantilever shunt capacitive switch

An analytical model to predict the surface roughness for the plasma-enhanced chemical vapor deposition (PECVD) process over a large range of temperature values is still nonexistent. By using an existing prediction model, the surface roughness can directly be calculated instead of repeating the experimental processes, which can largely save time and resources. This research work focuses on the investigation and analytical modeling of surface roughness of SiO2 deposition using the PECVD process for almost the whole range of operating temperatures, i.e., 80 to 450 °C. The proposed model is based on experimental data of surface roughness against different temperature conditions in the PECVD process measured using atomic force microscopy (AFM). The quality of these SiO2 layers was studied against an isolation layer in a microelectromechanical system (MEMS) for light steering applications. The analytical model employs different mathematical approaches such as linear and cubic regressions over the measured values to develop a prediction model for the whole operating temperature range of the PECVD process. The proposed prediction model is validated by calculating the percent match of the analytical model with experimental data for different temperature ranges, counting the correlations and error bars. 

/pdf/prediction-of-surface-roughness-as-a-function-of-temperature-200jvdd2.pdf

Prediction of Surface Roughness as a Function of Temperature for SiO2 Thin-Film in PECVD Process

Post-release deformation and curvature correction of an electrothermally actuated MEMS bilayer platform

RF MEMS switches are small in size, consume low power and have good RF response. However, the field deployment of RF MEMS switches is restricted due to limited power handling capability and reliability issues. In literature, power handling is improved through contact area either by adding hard materials or increasing the thickness. In the present paper, calculations for contact area versus stiction forces are performed and RF MEMS ohmic switch with optimal contact area is proposed and fabricated. The power handling of RF MEMS switch is increased by 55.86% without the addition of new material or processing steps. Insertion loss and return loss of the switch are also improved using corner compensation.

Contact Area Design of Ohmic RF MEMS Switch for Enhanced Power Handling

Packaging is one of the most critical tasks for MEMS devices. Unlike solid state devices, MEMS structures involves moving structures which needs to be protected from outer environment ensuring free movement of the structure. In the present paper, inverted silicon cavity is used for capping the MEMS devices. However, in case of RF MEMS, silicon cavity would add parasitics and affects its electrical performance. Enclosing the MEMS structure, its mechanical response will also alter. The electrical as well as mechanical characteristics of the RF MEMS switch are analyzed using finite element method simulations. The electrical response of the fabricated switch after packaging is compared with unpackaged device.

Low temperature epoxy bonding for RF MEMS capacitive switch

In this paper, we have reported a low cost method for depositing the hard alloy materials for electrical contact as well as MEMS structure application. Conventional methods of deposition like co-sputtering, e-beam PVD, etc. required a high running cost and had a high waste generation due to poor selectivity of deposition. The alloy formation was performed using a novel Electroplating method of synthesis. Au–Co alloy is made using a single bath electrodeposition for Au–Co thin films. XRD peaks analysis was used to confirm the alloy formation. AFM analysis was used to study the grains size, and surface roughness and the hardness measurement was performed using micro-indentation. The less surface roughness and high strength (Hardened) gold alloy formation were observed for a neutral pH (6.6 pH) Au–Co Alloy electroplating conditions. The low pH (4.0 pH) solution results to higher surface roughness while higher pH of the solution was not suitable for Au electroplating.

Khushbu

Papers

Post-release deformation and curvature correction of an electrothermally actuated MEMS bilayer platform

Contact Area Design of Ohmic RF MEMS Switch for Enhanced Power Handling

Low temperature epoxy bonding for RF MEMS capacitive switch

Low Cost Alloy Deposition for High Power Applications