Konstantin I. Popov

TL;DR: In this article, the current distribution in electrochemical cells is analyzed and the optimum conditions for electroplating and surface finishing of metal electrodeposits are discussed. But the authors do not consider the problem of metal deposition without an external current.

TL;DR: In this paper, the effect of hydrogen codeposition on the morphology of copper electrodeposits was studied and the dependences of the overall current and the volume of evolved hydrogen on the quantity of electricity used were plotted and the average current efficiencies of the evolved hydrogen were derived from them.

Abstract: Morphologies of copper deposits obtained at overpotentials belonging to the plateau of the limiting diffusion current density and at higher overpotentials were examined by the scanning electron microscopy (SEM) technique. Copper dendrites are formed at overpotentials belonging to the plateau of the limiting diffusion current density. The shape of copper dendrites depends on the electrodeposition overpotential. At higher overpotentials (800 and 1000 mV) and larger values of current densities, porous and very disperse copper deposits were obtained. These morphologies were a consequence of a very vigorous hydrogen evolution at these electrodeposition overpotentials. Also, the obtained copper structures consisted of agglomerates of copper grains. The size of copper grains is a function of the overpotential of electrodeposition, thus approaching to nano-sized dimensions is achieved when the electrodeposition overpotential is increased.

TL;DR: In this paper, the average current efficiency of hydrogen evolution and the scanning electron microscopic (SEM) analysis of the copper deposits morphology was examined by the determination of the average currents and by the analysis of copper dendrites.

TL;DR: In this article, the average current efficiency of hydrogen evolution and the morphology of formed copper deposits were examined by the determination of the averagecurrent efficiency and by the scanning electron microscopic (SEM) analysis of the formed copper.