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Lishi Wang

Researcher at Hubei University of Technology

Publications -  4
Citations -  39

Lishi Wang is an academic researcher from Hubei University of Technology. The author has contributed to research in topics: Surface roughness & Polishing. The author has an hindex of 2, co-authored 4 publications receiving 20 citations.

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Effect of nanosilica content on the corrosion inhibition of composite coatings of a filled epoxy resin grafted with a hydrophobic fluoroalkylsilane: a dual critical concentrations interpretation

TL;DR: In this article, 3,3,3-Trifluoropropylmethyldimethoxysilane (TMDMS) was successfully grafted to molecules of epoxy resin (EPR) of bisphenol-A origin with an epoxy value of 0.440, by transesterification (i.e. alcoholysis) of the TMDMS methoxyls with the EP44 hydroxyls under anhydrous dibutyltin-dilaurate catalysis.
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Studies on the electro-mechanical polishing effects of titanium alloy with ion-exchange resin solid particles

TL;DR: In this paper, a green electro-mechanical polishing method with ion-exchange resin solid particles saturating with acid electrolyte for metallic parts was used for polishing Ti6Al4V alloy samples and investigated the changes of subsequent surface morphology and electrochemical property.
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Fluoride effect on plasma electrolytic oxidation coating formed on Mg-Al alloy in alkaline electrolytes

TL;DR: In this paper, the authors tracked the fluoride evolvement contained in PEO ceramic protective layer formed on AZ91 magnesium alloys and found that a fluoride rich layer with 1-2 μm thickness is often formed at the coating/substrate interface and nanocrystalline MgO islands with size of 20-60 nm are found to be embedded in amorphous coating substrate.
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Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin

TL;DR: In this article, the polishing process and its property effects on 65 brass alloys were studied and the surface morphology analysis revealed that the surface roughness can be reduced by over 71.5% from 0.764 ± 0.031 μm to 0.218 − 0.080 μm with longer polishing time.