The millimeter wave (mmWave) frequency band spanning from 30 to 300 GHz constitutes a substantial portion of the unused frequency spectrum, which is an important resource for future wireless communication systems in order to fulfill the escalating capacity demand. Given the improvements in integrated components and enhanced power efficiency at high frequencies, wireless systems can operate in the mmWave frequency band. In this paper, we present a survey of the mmWave propagation characteristics, channel modeling, and design guidelines, such as system and antenna design considerations for mmWave, including the link budget of the network, which are essential for mmWave communication systems. We commence by introducing the main channel propagation characteristics of mmWaves followed by channel modeling and design guidelines. Then, we report on the main measurement and modeling campaigns conducted in order to understand the mmWave band’s properties and present the associated channel models. We survey the different channel models focusing on the channel models available for the 28, 38, 60, and 73 GHz frequency bands. Finally, we present the mmWave channel model and its challenges in the context of mmWave communication systems design.

/pdf/millimeter-wave-communications-physical-channel-models-qh94bqmhc1.pdf

Millimeter-Wave Communications: Physical Channel Models, Design Considerations, Antenna Constructions, and Link-Budget

An extensive review of the statistical characterization of 60-GHz indoor radio channels is provided from a large number of published measurement and modeling results. First, the most prominent driver applications for 60 GHz are considered in order to identify those environment types that need to be characterized most urgently. Large-scale fading is addressed yielding path-loss parameter values for a generic 60-GHz indoor channel model as well as for the office environment in particular. In addition, the small-scale channel behavior is reviewed including the modeling of time-of-arrival and angle-of-arrival details and statistical parameters related to delay spread, angular spread and Doppler spread. Finally, some research directions for future channel characterization are given.

/pdf/statistical-characterization-of-60-ghz-indoor-radio-channels-5cprmn2v8e.pdf

Statistical Characterization of 60-GHz Indoor Radio Channels

The worldwide opening of a massive amount of unlicensed spectra around 60 GHz has triggered great interest in developing affordable 60-GHz radios. This interest has been catalyzed by recent advance of 60-GHz front-end technologies. This paper briefly reports recent work in the 60-GHz radio. Aspects addressed in this paper include global regulatory and standardization, justification of using the 60-GHz bands, 60-GHz consumer electronics applications, radio system concept, 60-GHz propagation and antennas, and key issues in system design. Some new simulation results are also given. Potentials and problems are explained in detail.

/pdf/60-ghz-millimeter-wave-radio-principle-technology-and-new-56193nhs1l.pdf

60-GHz millimeter-wave radio: principle, technology, and new Results

After two decades of intensive development, 3-D integration has proven invaluable for allowing integrated circuits to adhere to Moore’s Law without needing to continuously shrink feature sizes The 3-D integration is also an enabling technology for hetero-integration of microelectromechanical systems (MEMS)/microsensors with different technologies, such as CMOS and optoelectronics This 3-D hetero-integration allows for the development of highly integrated multifunctional microsystems with small footprints, low cost, and high performance demanded by emerging applications This paper reviews the following aspects of the MEMS/microsensor-centered 3-D integration: fabrication technologies and processes, processing considerations and strategies for 3-D integration, integrated device configurations and wafer-level packaging, and applications and commercial MEMS/microsensor products using 3-D integration technologies Of particular interest throughout this paper is the hetero-integration of the MEMS and CMOS technologies [2015-0158]

3-D Integration and Through-Silicon Vias in MEMS and Microsensors

In this paper we investigate ad hoc networks based on impulse radio ultra wideband. Due to multiple access, the interference distribution is not Gaussian. One important reason for errors is the presence of close interferers generating pulse collision. However such events are rare and we propose an α-stable model compatible with this fact due to its heavy tailed distribution. We derive the analytical expression of the two significant parameters. They depend on the attenuation coefficient, the users' density, the pulse collision probability and the pulse shape. We finally propose receiver strategies (Cauchy receiver and p-norm) that outperforms the classical Gaussian receiver.

/pdf/a-stable-interference-modeling-and-cauchy-receiver-for-an-ir-zgr9mnejyu.pdf

α-stable interference modeling and cauchy receiver for an IR-UWB Ad Hoc network

This work deals with path-loss modeling of the indoor 60-GHz multipath channel. Measurement campaigns show that radio waves are confined inside rooms and allow fadings to be investigated. To identify the distributions describing both small- and large-scale fadings, goodness-of-fit tests are used and show they can be modeled by a log-normal distribution. © 2002 Wiley Periodicals, Inc. Microwave Opt Technol Lett 34: 158–162, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.10402

Path‐loss model of the 60‐GHz indoor radio channel

The purpose of this letter is to demonstrate the high potentiality in terms of data rate and multiple access of a novel 60-GHz WLAN architecture for smart objects and indoor communication systems This approach is based on the up-conversion of an ultrawide-bandwidth impulse radio signal (IR-UWB) in the 60-GHz frequency range to benefit of the natural advantages of the UWB technique while avoiding the baseband limitations First results about the pulse generator and receiver architecture are discussed

Transposition of a baseband UWB signal at 60 GHz for high data rate indoor WLAN

This paper presents benzocyclobutene (BCB) cap packaging of Microelectromechanical systems (MEMS) switches integrated with a thin monolithic microwave integrated circuit (MMIC) wafer. To prevent a possible breakage during BCB bonding process, the 100-μm-thick MMIC wafer is bonded to 680-μm-thick GaAs support before the release of MEMS switches. BCB cap packaging has been performed through BCB cap transfer technique based on antiadhesion monolayered Si carrier wafer. The thick GaAs support wafer has been separated by polymethyl methacrylate (PMMA) sacrificial etching through perforated access holes. The packaged MMIC wafer has been successfully diced using conventional dicing machine. The implemented BCB caps on the target MMIC have the height of 25 μm and the cavity of 12 μm for the housing of MEMS switches. The achieved success rate of BCB caps transfer is ~ 95%. The BCB cap packaging effect to microstrip line has been investigated through the S-parameters measurement before and after the packaging. In addition, the packaged MEMS switch shows the insertion loss of 0.7 dB, the return loss of 25 dB, and the isolation of 20 dB at 30 GHz.

BCB Cap Packaging of MEMS Switches Integrated With 100- $\mu{\rm m}$ MMIC Wafer

The purpose of this paper is to demonstrate the high potentiality in terms of data rate and multiple access of a novel 60 GHz WLAN architecture for smart objects and indoor Communication systems. This approach is based on the up-conversion of an Ultra Wide Bandwidth Impulse Radio signal (IR-UWB) in the 60 GHz frequency range to benefit of the natural advantages of the UWB technique while avoiding the base band limitations (FCC part 15).

https://ieeexplore.ieee.org/iel5/9603/30336/01394818.pdf

Transposition of a base band ultra wide band width impulse radio signal at 60 GHz for high data rates multiple access indoor communication systems

This paper presents a Si cap zero-level packaging technique based on a double-layer BCB sealing ring. The BCB ring is defined before the housing cavity etching to achieve high BCB bonding strength. It is found that the non-uniformity of the BCB ring defined on a Si cap with housing cavity prevents the package having high bonding strength. Three different packages have been prepared for shear test; a Si cap without cavity, a recessed Si cap with a conventional BCB ring and a recessed Si cap with pre-defined BCB ring. The three samples for each type of package are measured. The average measured bonding strengths of the test samples are 71, 16 and 42 MPa, respectively, and hence the proposed BCB sealing ring process provides 60 % of bonding strength of Si cap package without cavity for Si cap package with cavity. In addition, the insertion loss change of the packaged CPW is less than 0.1 dB up to 67 GHz while the return loss better than 15 dB at the measured frequency range.

M. Fryziel

Papers

Path‐loss model of the 60‐GHz indoor radio channel

Transposition of a baseband UWB signal at 60 GHz for high data rate indoor WLAN

BCB Cap Packaging of MEMS Switches Integrated With 100- $\mu{\rm m}$ MMIC Wafer

Transposition of a base band ultra wide band width impulse radio signal at 60 GHz for high data rates multiple access indoor communication systems

Enhancement of bonding strength of packaging based on BCB bonding for RF devices