An integrated verification and manufacturability tool provides more efficient verification of integrated device designs than verification using several different verification tools. The integrated verification and manufacturability includes a hierarchical database to store shared design data accessed by multiple verification tool components (e.g., layout versus schematic, design rule check, optical process correction, phase shift mask assignment and machine language conversion). The hierarchical database includes representations of one or more additional, or intermediate layer structures that are created and used by the verification tool components for operations performed on the design being verified. Use of a single hierarchical database having shared data for access and use by multiple verification components streamlines the verification process, which provides an improved verification tool.

Integrated verification and manufacturability tool

A semiconductor device includes a substrate and a number of diffusion regions defined within the substrate. The diffusion regions are separated from each other by a non-active region of the substrate. The semiconductor device includes a number of linear gate electrode tracks defined to extend over the substrate in a single common direction. Each linear gate electrode track is defined by one or more linear gate electrode segments. Each linear gate electrode track that extends over both a diffusion region and a non-active region of the substrate is defined to minimize a separation distance between ends of adjacent linear gate electrode segments within the linear gate electrode track, while ensuring adequate electrical isolation between the adjacent linear gate electrode segments.

Dynamic array architecture

The switch-level model represents a digital metal-oxide semiconductor (MOS) circuit as a network of charge storage nodes connected by resistive transistor switches. The functionality of such a network can be expressed as a series of systems of Boolean equations. Solving these equations symbolically yields a set of Boolean formulas that describe the mapping from input and current state to the new network states. This analysis supports the same class of networks as the switch-level simulator MOSSIM II and provides the same functionality, including the handling of bidirectional effects and indeterminate (X) logic values. In the worst case, the analysis of an n-node network can yield a set of formulas containing a total of O(n /sup 3/) operations. However, all but a limited set of dense, pass-transistor networks give formulas with O(n) total operations. The analysis can serve as the basis of efficient programs for a variety of logic design tasks, including logic simulation (on both conventional and special-purpose computers), fault simulation, test generation, and symbolic verification.

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Boolean Analysis of MOS Circuits

A method of forming integrated circuit (IC) chip shapes and a method and computer program product for converting an IC design to a mask, e.g., for standard cell design. Individual book/macro physical designs (layouts) are proximity corrected before unnesting and an outer proximity range is determined for each proximity corrected physical design. Shapes with a unique design (e.g., in boundary cells and unique instances of books) are tagged and the design is unnested. Only the unique shapes are proximity corrected in the unnested design, which may be used to make a mask for fabricating IC chips/wafers.

Method of IC fabrication, IC mask fabrication and program product therefor

A method is disclosed for defining a dynamic array section to be manufactured on a semiconductor chip. The method includes defining a peripheral boundary of the dynamic array section. The method also includes defining a manufacturing assurance halo outside the boundary of the dynamic array section. The method further includes controlling chip layout features within the manufacturing assurance halo to ensure that manufacturing of conductive features inside the boundary of the dynamic array section is not adversely affected by chip layout features within the manufacturing assurance halo.

Methods for Defining Dynamic Array Section with Manufacturing Assurance Halo and Apparatus Implementing the Same

In a pattern correction method, design layout data of a pattern designed by an automated layout unit is entered. An environmental profile is determined based on whether or not another graphics pattern exists at the surroundings of each correction target cell included in the entered design layout data. A target cell name is replaced with a prescribed cell name of correction pattern corresponding to the determined environmental profile by referencing a cell replacement table. An OPC correction pattern corresponding to the replaced cell name is imported from a cell library.

Pattern correction method, apparatus, and program

An automated wiring pattern layout method is provided. With this method, a first wiring pattern is generated with width W and extending in a first direction, and a second wiring pattern is generated with width W and extending in a direction perpendicular to the first wiring pattern in a manner such that the end thereof ends at the end portion of the first wiring pattern. Moreover, an overlapping region is generated by bending an end of either one of the first or the second wiring pattern at a right angle to produce an L-shaped extension and overlaying the first and the second wiring pattern, and a rectangular-shaped VIA pattern is generated at the overlapping region.

Automated wiring pattern layout method

A new LSI artwork analysis and processing system, called EMAP, is described with algorithms, a database schema and applications. EMAP provides the designer with the artwork verification and processing tools which include mask artwork processing, geometrical design rule checking, connectivity analysis and electrical circuit parameter calculation. The circuit connectivity data derived from the mask artwork data is used for input to a logic simulator, a timing simulator, a circuit simulator and a circuit schematic generator.

An Integrated Mask Artwork Analysis System

This paper describes three programs which perform connectivity rule check, logic gate recognition for logic simulation and circuit connectivity comparison. These programs have been developed for verifying circuit connectivity extracted from mask artwork. Powerful algorithms are used in these programs, including a heuristic graph comparison algorithm, to realize highly practical verification aids. Through the combined use of these programs, more cost-effective verification is possible.

Programs for Verifying Circuit Connectivity of MOS/LSI Mask Artwork

This paper describes a circuit comparison system which compares two networks and points out inconsistencies. A new approach is used to handle functionally isomorphic circuits which most conventional programs can not handle. Three techniques are included: network reduction, graph isomorphism-based comparison and rule-based functional isomorphism checking for inconsistencies. This system is efficient even for large networks and can eliminate false errors in a flexible manner.

Makoto Takashima

Papers

Pattern correction method, apparatus, and program

Automated wiring pattern layout method

An Integrated Mask Artwork Analysis System

Programs for Verifying Circuit Connectivity of MOS/LSI Mask Artwork

A circuit comparison system with rule-based functional isomorphism checking