Martin Moehrle

TL;DR: In this paper, the authors demonstrate a selection of beam-shaping elements at chip and fiber facets, achieving coupling efficiencies of up to 88% between edge-emitting lasers and single-mode fibres.

TL;DR: In this article, the authors demonstrate that photonic wire bonding can be achieved by exploiting direct-write two-photon lithography for in-situ fabrication of three-dimensional freeform waveguides between optical chips.

TL;DR: German researchers demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode fibres and form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

TL;DR: In this article, the authors demonstrate that photonic wire bonding can be achieved by exploiting direct-write two-photon lithography for in situ fabrication of three-dimensional free-form waveguides between optical chips.

TL;DR: In this article, a polymer-based external cavity tunable laser was investigated and the tuning efficiency was increased from 0.29 nm/mW to a record 0.52 nm /mW by improving the microheater thermal design.