Matteo Traldi

TL;DR: In this paper, the integration strategy of electronic and photonic ICs, 300mm process flow, and process variability are discussed, and performances of the passive and active optical devices are shown.

TL;DR: A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated and process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.

TL;DR: In this article, a driver for a DC-to-DC converter that may utilize a flyback or buck-boost converter circuit is described, where the driver includes a driver circuit and an interface circuit, and the interface circuit has a sensor sensing an input voltage from a DC supply and generating a sensor signal to a driver selector.

TL;DR: The ever-increasing demand for high network capacities and escalating data centers have pushed the boundary from discrete transceivers toward the integration of monolithic electro-optical ICs, and the cost advantage of a fully integrated silicon solution will eventually push classical discrete implementations toward obsolescence.

TL;DR: In this paper, a Silicon photonics platform operating at 100 Gbit/s (53Gbaud-PAM4) per lane is demonstrated, where a SiN layer allowing wideband fiber to the chip optical coupling and polarization management is introduced.