M
Maurice Heathcote Norcott
Researcher at IBM
Publications - 36
Citations - 1607
Maurice Heathcote Norcott is an academic researcher from IBM. The author has contributed to research in topics: Ohmic contact & Interposer. The author has an hindex of 17, co-authored 36 publications receiving 1607 citations.
Papers
More filters
Patent
Three dimensional high performance interconnection package
Brian Samuel Beaman,Fuad E. Doany,Keith E. Fogel,James L. Hedrick,Paul A. Lauro,Maurice Heathcote Norcott,John J. Ritsko,Leathen Shi,Da-Yuan Shih,George Frederick Walker +9 more
TL;DR: In this paper, an elastomeric interposer is constructed from a thermally conductive material such as diamond and a heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure.
Patent
High density cantilevered probe for electronic devices
TL;DR: In this article, a probe for electronic devices is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface, and the wires are cut off leaving stubs.
Patent
High density integrated circuit apparatus, test probe and methods of use thereof
Brian Samuel Beaman,Keith E. Fogel,Paul A. Lauro,Maurice Heathcote Norcott,Da-Yuan Shih,George Frederick Walker +5 more
TL;DR: In this paper, a test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material, and a mold is disposed surrounding the array of outwardly projecting wires to fill the spaces between the wires.
Patent
Interconnector with contact pads having enhanced durability
TL;DR: In this article, an enhanced durability interconnector is proposed to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board.
Patent
Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof
Brian Samuel Beaman,Keith E. Fogel,Paul A. Lauro,Maurice Heathcote Norcott,Da-Yuan Shih,George Frederick Walker +5 more
TL;DR: In this paper, a test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant of high modulus elastomeric material, and a mold is disposed surrounding the array of outwardly projecting wires.